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Comparative Study on Hydrogen Behavior in InGaZnO Thin Film Transistors with a SiO2/SiNx/SiO2 Buffer on Polyimide and Glass Substrates

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dc.contributor.authorHan, Ki-Lim-
dc.contributor.authorCho, Hyeon-Su-
dc.contributor.authorOk, Kyung-Chul-
dc.contributor.authorOh, Saeroonter-
dc.contributor.authorPark, Jin-Seong-
dc.date.accessioned2021-06-22T11:22:16Z-
dc.date.available2021-06-22T11:22:16Z-
dc.date.created2021-01-21-
dc.date.issued2018-11-
dc.identifier.issn1738-8090-
dc.identifier.urihttps://scholarworks.bwise.kr/erica/handle/2021.sw.erica/5184-
dc.description.abstractPrevious studies have reported on the mechanical robustness and chemical stability of flexible amorphous indium gallium zinc oxide (a-IGZO) thin-film transistors (TFTs) on plastic substrates both in flat and curved states. In this study, we investigate how the polyimide (PI) substrate affects hydrogen concentration in the a-IGZO layer, which subsequently influences the device performance and stability under bias-temperature-stress. Hydrogen increases the carrier concentration in the active layer, but it also electrically deactivates intrinsic defects depending on its concentration. The influence of hydrogen varies between the TFTs fabricated on a glass substrate to those on a PI substrate. Hydrogen concentration is 5% lower in devices on a PI substrate after annealing, which increases the hysteresis characteristics from 0.22 to 0.55V and also the threshold voltage shift under positive bias temperature stress by 2xcompared to the devices on a glass substrate. Hence, the analysis and control of hydrogen flux is crucial to maintaining good device performance and stability of a-IGZO TFTs. [GRAPHICS] .-
dc.language영어-
dc.language.isoen-
dc.publisherKOREAN INST METALS MATERIALS-
dc.titleComparative Study on Hydrogen Behavior in InGaZnO Thin Film Transistors with a SiO2/SiNx/SiO2 Buffer on Polyimide and Glass Substrates-
dc.typeArticle-
dc.contributor.affiliatedAuthorOh, Saeroonter-
dc.identifier.doi10.1007/s13391-018-0083-5-
dc.identifier.scopusid2-s2.0-85052907366-
dc.identifier.wosid000443991500011-
dc.identifier.bibliographicCitationELECTRONIC MATERIALS LETTERS, v.14, no.6, pp.749 - 754-
dc.relation.isPartOfELECTRONIC MATERIALS LETTERS-
dc.citation.titleELECTRONIC MATERIALS LETTERS-
dc.citation.volume14-
dc.citation.number6-
dc.citation.startPage749-
dc.citation.endPage754-
dc.type.rimsART-
dc.type.docTypeArticle-
dc.identifier.kciidART002402512-
dc.description.journalClass1-
dc.description.isOpenAccessN-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
dc.description.journalRegisteredClasskci-
dc.relation.journalResearchAreaMaterials Science-
dc.relation.journalWebOfScienceCategoryMaterials Science, Multidisciplinary-
dc.subject.keywordPlusGA-ZN-O-
dc.subject.keywordPlusOXIDE-
dc.subject.keywordPlusDIFFUSION-
dc.subject.keywordPlusDISPLAY-
dc.subject.keywordAuthorInGaZnO-
dc.subject.keywordAuthorThin film transistor-
dc.subject.keywordAuthorHydrogen-
dc.subject.keywordAuthorFlexible-
dc.subject.keywordAuthorPolyimide-
dc.identifier.urlhttps://link.springer.com/article/10.1007/s13391-018-0083-5-
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