Journal of Electronic Packaging, Transactions of the ASME
Journal Title
- Journal of Electronic Packaging, Transactions of the ASME
ISSN
- E 1528-9044 | P 1043-7398
Publisher
- ASME
Listed on(Coverage)
| JCR | 1997-2019 |
|---|---|
| SJR | 1999-2019 |
| CiteScore | 2011-2019 |
| SCIE | 2010-2021 |
| CC | 2016-2021 |
| SCOPUS | 2017-2020 |
Active
- Active
based on the information
- SCOPUS:2020-10
Country
- USA
Aime & Scopes
- Purpose The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems