ScholarWorks@Hanyang University ERICA Campus: Lee, Bang Wook

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Lee, Bang Wook (이방욱)

COLLEGE OF ENGINEERING SCIENCES (SCHOOL OF ELECTRICAL ENGINEERING)

Research Area: 전력기기/시스템/초전도공학

Tel 031-400-5665
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Liquid nitrogen:6||liquid nitrogen:6||Breakdown:5||dielectric breakdown:5||PPLP:5||DC:5||partial discharge:5||HVDC:4||polypropylene laminated paper (PPLP):4||AC:4||electrical conductivity:4||breakdown:4||high voltage:4||superconducting fault current limiter:4||Fault current:4||Kraft:3||cryogenic:3||LN2:3||resistive SFCL:3||GFRP:3||Partial discharge:3||epoxy:3||Al2O3:3||Superconducting fault current limiter:3||DC electric field analysis:3||cable insulation:3||EMTP:3||Cryogenic bushing:3||MVDC:3||dielectric strength:3||surface flashover:3||PSA:3||Surface flashover:3||FEM:3||SiO2:3||thermal aging:3||Electrical conductivity:3||Insulation design:3||HTS transformer:2||Optimization:2||Circuit Breaker:2||Insulation:2||small systems:2||smart grid:2||insulation:2||insulation coordination:2||stop joint box (SJB):2||cryostat:2||PHENIX:2||dc:2||dc electric field analysis:2||Superconducting fault current limiters:2||superconducting fault current limiter (SFCL):2||superconducting fault current limiters:2||liquid nitrogen (LN2):2||PRPD:2||Surface discharges:2||PSCAD/EMTDC:2||PSCAD/EMTDC program:2||Joint box:2||FRP:2||mixing ratio:2||LCCHVDC:2||electric field analysis:2||DC cable:2||vacuum interrupter:2||DC circuit breaker:2||HVDC cables:2||epoxy spacer:2||HVDC fault:2||fault current:2||VSCHVDC:2||Polymer insulator:2||Electric field analysis:2||Cooling:2||Electric fields:2||Flashover:2||BlackBox Arc Model:2||finite element analysis:2||XLPE:2||HVDC power transmission:2||DC electric field distribution:2||HVDC transmission:2||Arrhenius:2||Cryogenics:2||SF6:2||bipolar charge transport model:2||half bridge (HB):2||DC fault current:2||SFCL:2||Metallic particle:2||DC fault current limitation:2||DC HTS cable:2||butt gap:2||Electrodes:2||HFCT:2||Hightemperature superconductors:2||HTS:2||circuit breakers:2||hybrid SFCL:2||Creepage distance:2||DC insulation:2||HTS equipment:2||Hybrid fault current limiters:2||sheath grounding:2||Dielectrics:2||CAPD:2||Discharges (electric):1||Distribu:1||Distributed generation (DG) sources:1||Distributed parameter networks:1||Distribution class:1||Distribution electric network:1||Distribution system:1||EMTDC:1||Electric breakdown:1||Electric field dependency:1||Electric insulation:1||Electric power transmission networks:1||Electrical Conductivity:1||Electrical conductivity of arc:1||Electrical degradation:1||Electrical loss:1||Electrical safety:1||Electrogeometric model (EGM):1||Elongation:1||Epoxy resin:1||Equal channel angular extrusion:1||Explainable AI:1||FB topology:1||FBMMC protection scheme:1||FCL prototype:1||Failure:1||Fast front transients:1||Fault current limiters:1||Fault detection and identification:1||Filler:1||Finite Element Method (FEM):1||Finite element analysis:1||Finite element methods:1||Fixtures:1||Flexible Pulsed DC source:1||Fluoronitrile:1||Fluoronitrile mixture gas:1||Fluxlock type superconducting fault current limiter (SFCL):1||Full bridge (FB):1||Gas Insulated Switchgear:1||Geometry of Contact Support:1||Green NewDeal:1||HB system:1||HB technology:1||HTS (hightemperature superconductor) magnet:1||HTS electrical equipment:1||HTS magnet:1||HTS power devices:1||HTS transformers:1||HVDC Circuit Breaker (DCCB):1||HVDC HTS cable:1||HVDC LC Resonant Circuit Breaker:1||HVDC MIPPLP cable:1||HVDC MIPPLP cables:1||HVDC cable:1||HVDC circuit breaker:1||HVDC circuit breaker (DCCB):1||HVDC converter valve:1||HVDC fault analysis:1||HVDC fault current:1||HVDC fault current analysis:1||HVDC grid:1||HVDC grid protection:1||HVDC insulation:1||HVDC power convertors:1||HVDC power grid design:1||HVDC system:1||HVDC transmission system:1||HVDC underground cable:1||High‐voltage apparatus:1||High Voltage:1||High Voltage DC (HVDC) cable:1||High temperature superconducting:1||High temperature superconductors:1||High voltage AC CB:1||High voltage bushing:1||Highvoltage direct current (HVDC) circuit breaker (DCCB):1||Highvoltage directcurrent (HVDC):1||Higher efficiency:1||Hybrid DCCB:1||HybridMMC:1||IEC standards:1||IGBT Valves:1||IGBT valves:1||Insulation aging:1||Insulation diagnosis:1||Insulator:1||Integrated circuit modeling:1||Keypoints:1||LVDC CLCB:1||Largescale solar power plants:1||Layer structure:1||LevenbergMarquardt Algorithm (LMA):1||Liftoff voltage:1||Lightning:1||Liquid Nitrogen:1||Liquind Nitrogen:1||LongTerm:1||Low voltage DC distribution:1||MIPPLP:1||MICROfiller:1||MMCHVDC bipolar links:1||MMCHVDC bipolar systems:1||MOSA:1||MTDC:1||MTDC grid:1||MVDC Circuit Breaker:1||MVDC System:1||MVDC transmission:1||Magnetic Field Analysis:1||Massimpregnated cable:1||Matlab Simulink:1||Microstructure:1||Modeling and simulation:1||Modular Multilevel Converter:1||Modular multilevel converter (MMC):1||Multiterminal HVDC:1||Multiterminal HVDC (MTDC):1||Neural networks:1||Noise measurement:1||Nonlinear Characteristics:1||Novec:1||Numerical analysis:1||N₂:1||OHLcable mixed HVDC transmission:1||Outdoor termination:1||Overvoltage:1||PCS (pyro conductor switch):1||PD:1||PDIV:1||PRCB:1||PSCAD:1||PTFE:1||PV plant:1||Parameter estimation:1||Parameter optimization:1||Parametric Sweep Method:1||Partial Discharge Inception Voltage:1||Partial Discharge Simulation:1||Partial Discharge under DC:1||Partial discharge sensor:1||Passive oscillation DC circuit breaker:1||Pattern analysis:1||Pattern classification:1||Pattern recognition:1||Poles and towers:1||Power apparatus:1||Power cable insulation:1||Power cables:1||Power grids:1||Power networks:1||Protection:1||QGP:1||Real‐time monitoring:1||Reliability:1||Resear:1||Resins:1||Resistive superconducting fault current limiter:1||Resistive superconducting fault current limiter (SFCL):1||Resistive type SFCL:1||Resistive type SFCL (RSFCL):1||SF6 Bushing:1||Saturated iron core type SFCL (SICSFCL):1||Schwarz black box arc model:1||Schwarz model parameters:1||Schwarz's black box arc model:1||Sensors:1||Shielding failure:1||ShortTerm:1||Silicone polymers:1||Simulink:1||Solar photovoltaic:1||Spacer:1||Spheroidisation:1||Stainless Steel:1||Steel:1||Substations:1||Superconducting:1||Superconducting DC cable system:1||Superconducting DCCB:1||Superconducting Equipment:1||Superconducting Fault Current Limiter:1||Superconducting cables:1||Superconducting fault current limiter (SFCL):1||Superconducting magnets:1||Superconductivity:1||Superimposed lightning impulse voltage:1||Surges:1||Switches:1||Thermal conductivity:1||Thermal shock:1||Three phase faults:1||TiO2:1||Transformer oil:1||Transformers:1||Transient analysis:1||Triple point:1||Twoparticle angular correlations:1||UHF measurements:1||UHF sensor:1||Underground power cables:1||VCB:1||VI:1||VSC:1||VSC HVDC:1||Vacuum Interrupter:1||Vacuum degree:1||Void:1||Voltage trace:1||Warmup and cooldown test:1||Weibull:1||Wire/Spherical shape:1||Withstand voltage:1||XRD:1||YBCO coated conductor:1||ac arc characteristics:1||accelerated aging time:1||air clearance:1||allowable current:1||angle of slits:1||authors:1||backward physics:1||blackbox arc model:1||blackbox model:1||blackbox modelling:1||breakdown characteristic:1||bushing:1||cable accessories:1||cable overvoltage:1||cavity formation:1||chemical:1||circuitbreaking arcs:1||collective flow:1||collectivity:1||component:1||contact support configuration:1||continuously transposed coated conductor (CTCC):1||converter topologies:1||converter valveside faults:1||convolution neural network (CNN):1||cooling system:1||cooling tower:1||corona discharge:1||correlation with Tan δ:1||critical flashover voltage:1||current distribution:1||dc arc current waveform:1||dc arc feasibility:1||deaerator booster pump:1||dielectric characteristics:1||dielectric materials:1||dielectrics:1||differential current protection:1||dileptons:1||direct burial laying:1||direct photons:1||discharge:1||distribution class:1||dryair:1||effective DC circuit breaker:1||elastic materials:1||electrical degradation:1||electrical fault:1||electrode roughness:1||electrodes shape:1||electromagnetic transient (EMT) simulation:1||electromagnetic transient simulation:1||environmental pollution:1||epoxy composite:1||epoxy insulator:1||explainable artificial intelligence (XAI):1||extremely and weakly nonuniform electric fields:1||fault current limiter:1||fault currents:1||fault detection:1||faulty line isolation:1||feasible fault protection strategy:1||feasible protection strategy:1||field analysis:1||field breakdown:1||finite element method (FEM):1||finiteelement method:1||fluid:1||formatting:1||forward physics:1||full bridge (FB):1||fullbridge modular multilevel converter protection:1||fullbridge voltage source converter:1||gel time:1||glass fiber reinforced polymer (GFRP):1||gradient weighted class activation mapping (GradCAM):1||hadrons:1||halfbridge voltage source converter:1||heavy flavor:1||high voltage apparatus:1||high voltage insulation:1||highfrequency current transformer sensor:1||hightemperature superconducting (HTS) cable:1||hightemperature superconductivity (HTS) cable:1||highvoltage direct current grid:1||highvoltage power equipment:1||higher cost compared:1||humidity:1||hybrid DCCB (HDCCB):1||hybrid HVDC breaker (HCB):1||hybrid SFCL (HybridSFCL):1||hybrid transmission corridor:1||impregnated insulation:1||inception voltage:1||inductive SFCL:1||inductive shielded core SFCL:1||inductive type:1||initial state:1||insert:1||insulating material:1||insulating oil:1||insulating paper:1||insulation flashover:1||insulator:1||insulator flashover:1||interface:1||interface pressure:1||interruption performance:1||kraft:1||large gap distance:1||level of LN2:1||lightning overvoltage:1||liquefaction:1||longterm breakdown:1||longterm reliability:1||low voltage DC microgrid:1||low voltage DCCB:1||machine direction:1||maintenance criteria:1||maximum shielding failure:1||mechanical:1||micro grid:1||microgrid:1||mineral oil:1||modular multilevel converter (MMC):1||monitoring:1||multi objective genetic algorithm:1||multiparticle correlation:1||multiple valve unit:1||multiterminal HVDC:1||nanocomposite:1||nanofiller:1||negative lightning strikes:1||negative lightning strokes:1||neighboring grid:1||nonhalf cycle current limiting:1||number of slits:1||optimal design:1||optimisation:1||overhead ground wire:1||oxygen content:1||parametric analysis:1||parametric sweep:1||passive oscillation DC CB:1||passive resonance DC breaker:1||passive resonance circuit breaker:1||pattern:1||pattern classification:1||persistent current mode:1||polypropylene laminated paper (PPLP):1||polypropylene laminated paper:1||power cable:1||power convertors:1||power grid:1||power grids:1||power system faults:1||power systems:1||pressboard:1||pressure analysis:1||probability:1||protection devices:1||pulse wave shape:1||quark gluon plasma:1||quarkgluon plasma:1||quarkonia:1||quench:1||recloser:1||recovery characteristics:1||relaxation of electric field:1||resistive SFCL (RSFCL):1||resistive superconducting fault current limiter:1||resistive type:1||response surface method:1||reverse current:1||rib:1||ribbed post insulator:1||ripple factor:1||riser section:1||rod post insulator:1||saturated iron core SFCL:1||saturated iron core SFCL (SISFCL):1||search coil:1||selection criteria:1||serviceaged XLPE cable:1||sheath grounding scheme:1||sheath loss calculation:1||sheath voltage calculation:1||simulate dynamic arccircuit interaction:1||simulation:1||singlephase valveside MMC fault:1||small system:1||space charge:1||space charge behavior:1||space charge dynamics:1||steady state induction:1||stop joint box:1||streamer:1||striation:1||style:1||styling:1||suggested protection scheme:1||superconducting cable:1||superconducting devices:1||superconducting equipment:1||superconducting joint:1||superconducting material:1||superconductor's trigger:1||superimposed:1||surface breakdown:1||surface leakage current:1||switching impulse:1||switching impulse superimposed on DC voltage:1||switching impulse superposition:1||synthetic ester:1||tangential electric field:1||tensile stress:1||thermal resistance:1||thermal shock:1||threshold electric field:1||travelling wavebased fault location:1||triple points:1||ultrasonic corona imaging diagnostic equipment:1||universal line model (ULM):1||utilization factor:1||void defect:1||voltage polarity reversal:1||voltage source converters (VSC):1||voltage stress:1||voltagesource converter:1||warmup and cooldown test:1||wind farm:1||$CF_4$:1||windandflip:1||22.9 kV largecapacity distribution line:1||4:1||AC XLPE cable:1||AC loss:1||AC voltage:1||ACDC combined voltage:1||AMF vacuum interrupter:1||ATH:1||Accelerated degradation:1||Air clearance:1||Analytical models:1||Annealing:1||Arc runner:1||ArcCircuit Interactions:1||Atmospheric modeling:1||Axial Magnetic Field:1||BDV:1||BFP:1||BMC:1||Backflashover:1||Behavior characteristic:1||Behaviour analysis:1||Bidirectional current:1||Bipolar lightning strokes:1||Black Box Arc Model:1||BlackBox Arc Models:1||Blackbox Model:1||Blackbox arc model:1||Breakdown characteristic:1||Breakdown characteristics:1||Breakdown test:1||Breakdown voltage:1||Breakdwon Voltage:1||Bushing:1||Buttgap:1||CB's technical data:1||CF4:1||CGN2:1||Capacitance:1||Capacitive Equivalent model:1||Castresin transformer:1||Circuit breaker:1||Circuit breakers:1||Closed box:1||Commutation failure:1||Composite insulation:1||Comsol:1||Conduction cooling:1||Conduction current:1||Conductive particle:1||Converter valve:1||Copper deposition:1||Corona shield:1||Cross direction:1||Cryogenic:1||Cryogenic Bushing:1||Cryogenic dielectric materials:1||Cryogenic insulation:1||Cryogenic insulation materials:1||Cryogenic temperature:1||Cryogenic test facilities:1||Cryostat:1||Current carrying capability:1||Current interruption process:1||Current stress:1||Current trace:1||DC Arcing Chamber:1||DC Circuit Breaker:1||DC Distribution System:1||DC Electric Arc Analysis:1||DC Electric Field Analysis:1||DC Fault Current Limiter:1||DC arc:1||DC arc analysis:1||DC arc characteristics:1||DC arc modeling:1||DC building:1||DC circuit breaker (DCCB):1||DC circuit breakers:1||DC corona inception electric field:1||DC distribution system:1||DC electric field:1||DC electrical system:1||DC error:1||DC fault interruption:1||DC grid:1||DC insulator:1||DC interruption:1||DC partial discharge:1||DC prestress:1||DC railway:1||DC ship:1||DC stress:1||DC surface flashover:1||DC transmission:1||DC void discharge:1||DC voltage:1||DCCB:1||Darcy's law:1||Data models:1||Dc cable:1||Dc electric field analysis:1||Defect:1||Deposition:1||Dielectric performance:1||Dielectric strength:1||

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