ScholarWorks@Hanyang University ERICA Campus: Oh, Je Hoon

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Oh, Je Hoon (오제훈)

ERICA 공학대학 (DEPARTMENT OF MECHANICAL ENGINEERING)

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Tel 031-400-5252
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Inkjet printing:13||Printed electronics:4||Computational fluid dynamics:4||inkjet printing:4||Plasma treatment:3||Soft lithography:3||Surface wettability:3||Finite element analysis:3||Inkjet Printing:3||Surface characterization:3||Nanofibers:3||SENSORS:3||NANOPARTICLES:3||Electrospinning:3||Optimum design:3||Additive manufacturing:3||ELECTRONICS:3||Vascular resistance:2||fluidstructure interaction:2||Proximity exposure:2||Wearable electronics:2||statistical approach:2||Wettability:2||Inkjet:2||strength:2||Contact angle:2||hemodynamic factors:2||Hemodynamic parameters:2||triboelectric nanogenerator (TENG):2||Circle of Willis:2||adhesive joints:2||laminates theory:2||Damping:2||High specific stiffness:2||GMAW:2||Composite materials:2||micromechanics:2||Crystalline structure:2||PERFORMANCE:2||Gas metal arc welding:2||POLYMER:2||Resistivity:2||capacitive pressure sensor:2||Surface treatment:2||nonlinear behavior:2||Surface wettability contrast:2||Micromechanics(미시역학):2||LINES:2||LIQUID:2||Electrohydrodynamic:2||Anterior communicating artery aneurysms:2||3D printing:2||computational fluid dynamics:2||polymermatrix composites (PMCs):2||Cerebral aneurysm:2||printed electronics:2||Ag nanoparticle ink:2||random fiber array:2||representative volume element (RVE):2||residual thermal stress:2||ENERGY:2||SUBSTRATE:2||Porous structures:2||SYSTEM:2||electrospinning:2||Triboelectric nanogenerator (TENG):2||Exothermic reaction:2||Sandwich structure:2||Drop morphology:1||Drop transfer:1||Droplet Profile:1||Droplet Superimposition:1||Droplet sizes:1||ELASTICMODULUS:1||ENHANCEMENT:1||Electrical Sintering:1||Electrical resistivity:1||Electrical sintering:1||Electrohydrodynamic printing:1||Electrochemical Reaction:1||Electrohydrodynamic patterning:1||Electronic nose system:1||Electrospun nanofiber:1||End effector:1||Energy harvesting:1||Evaporation behavior:1||FDB:1||FIELDEFFECT TRANSISTORS:1||FILM:1||FILMS:1||FLOW:1||FORCE SENSOR:1||FSI:1||FTIR:1||FUTURE:1||Fastening behavior:1||Fatigue:1||Fatigue life:1||Finite element method:1||Flexible power source:1||Flexible substrates:1||Flexure mechanism:1||Foam core:1||Fundamental natural frequency:1||GENERATOR:1||GRAVITY:1||Gap control:1||Gas sensor:1||Glass panel display:1||Grain growth:1||Grey relation analysis:1||HARDNESS:1||HEATTRANSFER:1||HUMANMACHINE INTERFACES:1||Hardness:1||Heat transfer simulation:1||Heddle frame:1||Hemodynamic parameter:1||Hemodynamics:1||Hierarchically porous polymer composite:1||High dynamic:1||High specific strength:1||High speed photography:1||Highresolution printing:1||Honeycomb:1||Hybrid joint:1||Hybrid patterning:1||Hydrophilic surfaces:1||Hydrophobic coating:1||INDENTATION:1||INKS:1||INTRACRANIAL ANEURYSMS:1||Inconel 718:1||Initial resistance:1||InkJet Printing:1||Inkjet Patterning(잉크젯 패터닝):1||Interfacial Strains(경계면 변형률):1||Interlaminar shear test:1||Intracranial aneurysms:1||Iosipescu:1||Iterative solution:1||Kinematic coupling:1||Kinetic model:1||LCD glass panel:1||LEVITATED DROPS:1||Laminated Composite Tube(적층 복합재료 튜브):1||Laser ablation:1||Life prediction:1||Limitofdetection:1||Line Pattern:1||Line beam:1||Line instability:1||Linear circuits:1||Liquid droplets:1||Loom:1||MECHANICALPROPERTIES:1||METHODOLOGY:1||MORPHOLOGY:1||MOTION:1||MWCNTs/PDMS/AgNWs composite:1||Mask holder:1||Mask stage:1||Mechanical engineering:1||Meniscus:1||Metal 3D printing:1||Metal Printing:1||Metal Transfer:1||Metal fine patterns:1||Micropositioning stage:1||Microwave treatment:1||Morphology:1||Mud Crack:1||Multiple objective functions:1||NANOINDENTATION:1||Nanogenerator:1||Nanoindentation:1||Nanoparticle ink:1||Nanosilver suspension:1||Neutral density filter:1||Nonlinear Behavior of Adhesive(접착제의 비선형 거동):1||Nonlinear behavior:1||Nonlinear shear behavior of adhesive:1||Nozzle design:1||OPTIMIZATION:1||Optical mount:1||Organic Thin Film Transistor:1||Organic thin film transistor:1||Orthogonal array:1||P(VDFTrFE):1||PDMS stamp:1||PECVD(플라즈마 화학증착):1||PENDANT:1||PIV method:1||POLYMER NANOFIBERS:1||POLYMERS:1||PVDF:1||PVDFTrFE:1||Paper:1||Paper substrate:1||Particle image velocimetry methods:1||Passive components:1||Phase transitions:1||Plasma surface treatment:1||Plastic boss:1||Plastic joints:1||Polydimethylsiloxane:1||Polydimethylsiloxane (PDMS):1||Pressure sensor:1||Pulsed Gas Metal Arc:1||REGIONS:1||REMOVAL:1||RESOLUTION:1||RISK:1||RUBBER:1||RUPTURE:1||Random Fiber Array (랜덤배열):1||Random Fiber Array(랜덤 섬유 배열):1||Regular Fiber Array(규칙배열):1||Regular Fiber Array(규칙섬유 배열):1||Representative Volume Element(RVE:1||Representative Volume Element(RVE, 대표체적요소):1||Residual Thermal Stress(잔류 열응력):1||Residual thermal stress:1||Residual thermal stresses:1||Response surface method:1||SN curve:1||SELFORGANIZATION:1||SEMICONDUCTORS:1||SHEARSTRESS:1||SILVER:1||SILVER TRACKS:1||SKIN:1||SLIDING ELECTRIFICATION:1||SOLAR:1||SOLIDSTATE SUPERCAPACITORS:1||SPFC980Y:1||SS 275:1||STABILITY:1||STS 316L:1||SUSPENSIONS:1||Sandwich:1||SelfPiercing Rivet:1||Selftapping screw:1||Shape:1||Shielding Gas:1||Solid substrates:1||Spatter Generation:1||Specific Resistivity:1||Stent:1||Stiffness:1||Substate Temperature:1||Substrate:1||Surface Analysis(표면분석):1||Surface Modification(표면처리):1||Surface energy:1||Surface microstructure:1||Surface modification:1||Surface morphology:1||Surface roughening:1||Surface texturing:1||TEMPERATURE:1||THINFILM:1||TIPS Pentacene:1||TIPS pentacene:1||TIPSPENTACENE:1||TRACKS:1||TRANSPARENT:1||Taguchi method:1||Temperature overshoot:1||Thermal expansion:1||Thick carbon/epoxy composite:1||Thick composite laminates:1||Thick composites:1||Threedimensional model reconstruction:1||Ti Alloy:1||Ti6Al4V alloy:1||Torque capacity:1||Torque transmission capability:1||Triboelectric nanogenerator:1||Triboelectricity:1||UV treatment:1||WATERWAVE ENERGY:1||WSS:1||Wire Arc Additive Manufacturing (WAAM):1||Wire Melting:1||Wire cutting:1||Wrist block:1||YOUNGS MODULUS:1||Young&apos:1||acoustic emission:1||acoustophoresis:1||adhesion:1||advanced high strength steel:1||allinkjetprinted capacitor:1||allinkjetprinted organic thin film transistor:1||aneurysm:1||artificial neural networks:1||blade:1||bolt preload:1||bolted joint:1||boundary conditions:1||bulging instability:1||carbon nanotube (CNT):1||cell array:1||cell manipulation:1||cell membraneanchoring polymer:1||cell patterning:1||cerebral aneurysm:1||cerebrovascular replica:1||circle of Willis:1||coffee stain effect:1||composite material:1||composite materials:1||contact force distribution:1||crystalline structure:1||damping:1||deformation and fracture:1||deposition characteristic:1||dielectric layer:1||dielectrophoresis:1||drug screening:1||dualfunctionality:1||electrical double layer (EDL):1||electrophoresis:1||failure mode:1||fatigue behavior:1||finite element analysis:1||flexible pressure sensors:1||fluid simulation:1||force sensor:1||fracture surface:1||friction:1||geometrical characteristics:1||glass cutting:1||healthcare monitoring:1||hemodynamic parameters:1||hybrid composite flywheel rotor:1||inkjet:1||inner pressure:1||interfacial strains:1||intracranial aneurysms:1||ionic liquid:1||laser ablation:1||layerbylayer coatings:1||magnetic abrasive finishing:1||magnetophoresis:1||microelectrodes:1||molecular weight:1||morphology:1||multiple aneurysms:1||nanoparticle ink:1||nanoparticle inks:1||nanosilver line:1||nonzero receding contact angle:1||nugget size:1||optical tweezers:1||overprinting:1||paper substrate:1||parent artery segmentation:1||picosecond laser:1||piezoelectric inkjet printing.:1||plasmatreated substrates:1||poly4vinylphenol:1||polyethylene oxide (PEO) solution:1||polyethylene oxide(PEO):1||polymer composite:1||porous PDMS:1||porous structures:1||preload monitoring:1||printing variables:1||rapid electrokinetic patterning:1||resistance change:1||resistance spot welding:1||rubber:1||rubber blade:1||s modulus:1||selfpowered device:1||selfpowered pressuresensor:1||semiconductor layer:1||silver:1||sintering:1||sneurointerventional endovascular simulator:1||snug point:1||sodium chloride (NaCl):1||spin test:1||strain invariant failure theory (SIFT):1||strain measurement:1||surface modification:1||surface roughness:1||surface wettability:1||threshold voltage:1||torque capacity:1||transverse loading:1||triboelectric pressure sensor:1||truck wheel:1||tubular adhesive joint:1||vibrational behaviour:1||volume of fluid:1||wall shear stress:1||wearable devices:1||wearable electronics:1||windshield wiper:1||wiper:1||wiper system:1||wrinkled microstructure:1||감쇠:1||고무:1||공학 / Engineering:1||교신저자(Email:jehoon@hanyang.ac.kr)일반적으로 복합재료 구조물에서 접합부는 가장 취약한 부분이고:1||구조의 건전성은 복합재료 구조 자체보다는 접합부에:1||내압:1||대표체적요소):1||마찰:1||변형률 측정:1||복합재료 피접착체(Composite adherends):1||블레이드:1||비선형 거동(Nonlinear behavior):1||스핀 테스트:1||와이퍼:1||적층 복합재료 튜브(Laminated composite tube) 韓國複合材料學會誌 29*+ 한양대학교 기계정보경영공학부:1||접착 조인트(Adhesive joints):1||정밀기계:1||하이브리드 복합재 플라이휠 로터:1||6,13Bis(triisopropylsilylethynyl) pentacene:1||808 nm diode laser:1||AG LINES:1||ARRAYS:1||ASSISTED SYNTHESIS:1||ATOMIZATION:1||Adhesive:1||Adhesive Joints(접착 조인트):1||Adhesive joints:1||Adhesively bonded tubular lap joint:1||Analysis conditions:1||Aneurysm:1||Aneurysm formation:1||Autoclave cure cycle:1||BEHAVIOR:1||BUBBLE:1||Band pass filter:1||Biomolecule separation:1||Blood viscosity model:1||Bolt:1||Bolt/Nut:1||Box beam:1||Buckling:1||CFD:1||CFRTP:1||CIRCUITS:1||COMPUTATIONAL FLUIDDYNAMICS:1||CONDUCTIVITY:1||Camera systems:1||Cantilever arm:1||Capacitance:1||Capacitive pressure sensor:1||Capacitive pressure sensors:1||Carbon blackpolymer composite:1||Carbon fiber epoxy composite:1||Carbon/epoxy composite material:1||Cathode Spot:1||Cerebral aneurysms:1||Coffee ring effect:1||Colloidal particle:1||Combined template method:1||Compaction:1||Composite:1||Composite Adherend(복합재료 접착체):1||Composites:1||Conductive Ink:1||Consolidation:1||Convection model:1||Correction factor:1||Cracks:1||Cu Nanoparticles:1||Cure cycle:1||Cure simulation:1||DEPOSITION:1||DISCHARGES:1||DROP:1||DYNAMICS:1||Damping capacity:1||Deposition quality:1||Deposition rate:1||Design of Experiment(실험계획법):1||Design of experiments:1||Desktop forming system:1||Diagonal nozzle:1||Direct energy deposition:1||Dispenser:1||Double arm type robot:1||

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