ScholarWorks@Hanyang University ERICA Campus: Kim, Jong ryoul

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Kim, Jong ryoul (김종렬)

COLLEGE OF ADVANCED TECHNOLOGY AND CONVERGENCE (MAJOR IN ADVANCED MATERIALS AND SEMICONDUCTOR ENGINEERING)

Research Area: 금속

Tel 031-400-5228
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Magnetic properties:7||Microstructure:6||permanent magnet:5||TEM:5||equal channel angular pressing:4||Magnetic domains:4||ferromagnetic resonance:4||twinning:3||6.5 wt% silicon steel:3||slip:3||soft magnetic composite:3||Transmission electron microscopy:3||highfrequency characteristics:3||strontium ferrite:3||titanium:3||Xray diffraction:3||B2 and D0(3) ordered phases:2||Hexaferrite:2||Sputtering:2||Ceramics:2||Chemical synthesis:2||Mechanical properties:2||Electrolysis:2||high coercivity:2||exchangecoupling effect:2||permeability:2||high frequency:2||microstructure:2||THINFILMS:2||Meltspinning:2||Dewpoint treatment:2||lowtemperature cofired ceramics (LTCC) inductor:2||soft magnetic property:2||soft magnetic thin film:2||highfrequency properties:2||nanocomposite:2||Laser powder bed fusion:2||Core loss:2||inductance:2||nanocrystalline:2||magnetic permeability:2||wireless power chargers (WPC):2||Amorphous:2||superparamagnetic:2||Sintering:2||texture:2||noise suppression:2||electrospinning:2||magnetic force microscopy (MFM):2||Magnetic force microscopy:2||planartype inductor:2||FeSi powders:2||exchangecoupling:2||Reductiondiffusion process:2||twin:2||MAGNETICPROPERTIES:2||STRENGTH:2||magnetic properties:2||Permanent magnet:2||Inkjet printing:2||rhombohedral Zr2Co11:2||magnetite:2||magnetization:2||Crystal structure:1||Crystallite size:1||Crystallization:1||D0(3) antiphase boundaries:1||D0(3) antiphase boundary:1||DC/DC converter:1||DECOMPOSITION:1||DEFORMATIONBEHAVIOR:1||DEVICES:1||Dehydride:1||Differential thermal analysis:1||Direct printing:1||Dislocation:1||Dispersion Stability:1||Dualnozzle material extrusion (DMEX):1||EBSD:1||EBSD microstructure:1||ELECTRICAL RELIABILITY:1||ELECTRICALPROPERTIES:1||Easyaxis magnetic alignment:1||Electrodeposition:1||Electrodeposition  magnetic alloys:1||Electroless plating:1||Electron microscopy:1||Electronic properties:1||Electrospinning:1||Energy density:1||FEPD:1||FERROMAGNETIC NANOPARTICLE COMPOSITES:1||FETAN FILMS:1||FORMICACID:1||FREQUENCY:1||Failure rate:1||Fe4.5Si:1||Fe6.5Si magnetic cores:1||Fe6.5Si soft magnetic cores:1||FeAl2O3 composite powders:1||FeBCeLa alloys:1||FeCoB thin film:1||FeCoNiB thin films:1||FeSi:1||FeSi soft magnetic alloys:1||Febased:1||Fe/MgO:1||Fe2O3 nanopowder:1||Fe@FeSiAl oxide nanopowder:1||FeCoBN:1||Ferromagnetic resonance:1||Fourier infra red:1||Fracture:1||GAAS:1||Ga1xMnxN:1||Gasatomization process:1||Grain boundaries:1||Grain growth:1||Graingrowth:1||Grainoriented silicon steel:1||HEATRESISTANT STEELS:1||HREM:1||Hard magnets:1||Heat treatment:1||Heterojunctions:1||High aspect ratio via:1||High coercivity:1||High entropy alloy:1||Highfrequency applications:1||Hydride:1||IRON FILMS:1||Inductive sensor:1||InkJet Printing:1||Inkjet printing technology:1||Instrumentation amplifier (IA):1||Integrated circuit (IC):1||Interfacial Contact Resistance:1||Interfacial segregation:1||Intermediate heat treatment:1||Iron Nanopowder:1||Iron alloys:1||Iron loss:1||LOWCARBON STEELS:1||LTCC inductor:1||LTP:1||LTP MnBi:1||LTPMnBi:1||LaAlO3:1||LandauLifshitzGilbert (LLG) equation:1||Laser beam profiles:1||Low sintering temperature:1||Lowfield microwave absorption:1||MARTENSITIC 9CR STEELS:1||MECHANICALPROPERTIES:1||METALS:1||MICROSCOPY:1||MICROSTRUCTURE EVOLUTION:1||MICROWAVE PROPERTIES:1||MULTILAYERS:1||Magnetic align:1||Magnetic alignment:1||Magnetic array:1||Magnetic composite sheet:1||Magnetic epitaxial layers:1||Magnetic field sensors:1||Magnetic hysteresis:1||Magnetic particle:1||Magnetic permeability:1||Magnetic property:1||Magnetic thin films:1||Magnetization reversal:1||Martensite:1||MeltSpinning:1||Metal Nanoparticles:1||MetalinsulatorMetal (MIM) structure:1||Mg(OH)2 nanoparticles:1||MnAlC:1||MnBi:1||MnBi alloy:1||Modified 9Cr2W steel:1||Molten salt:1||Molten salt method:1||Molten salt process:1||NANOMETERSIZED CARBIDES:1||NB:1||Nanoparticle:1||Nanopowder:1||Nanostructured materials:1||NiZn ferrite:1||NiZn ferriteparasitic resistance:1||Nitrogen:1||Nonagglomerate:1||Nondestructive testing:1||Nonlinear absorption:1||OXIDATION:1||Optical limiting:1||PD:1||PEMFCs:1||PERMITTIVITY:1||POWERPLANTS:1||Particle size distribution:1||Permanent Magnet:1||Permanent magnets:1||Perpendicular magnetic anisotropy:1||Photocatalysis:1||Powder:1||Powders:1||Powders: solid state reaction:1||Precipitates:1||READ HEADS:1||RECOVERY:1||REDUCTION:1||RESISTIVITY:1||REVERSAL:1||Radiationhardening technology:1||Rareearth free:1||Rareearth free permanent magnet:1||Remanence Value:1||Resistivity:1||STACKINGFAULT ENERGY:1||STATIC RECRYSTALLIZATION:1||STRENGTHENING MECHANISMS:1||STRIP STEELS:1||STRIPLINE TECHNIQUE:1||Salt assisted ultrasonic spray pyrolysis:1||Samarium cobalt:1||Samariumcobaltiron:1||Saturation magnetization:1||Seed layer:1||Selfpropagation process:1||Semiconductors:1||Single composite target:1||Sinterable insulation:1||Sintered magnetic cores:1||SmCo hard magnetic materials:1||Sm2Co17/FeCo nanocomposite magnets:1||Soft Magnet:1||Soft magnet:1||Soft magnetic composite:1||Soft magnetic composites:1||Soft magnetic film:1||Soft magnetic thin film:1||Solar cell:1||Spark plasma sintering:1||Spark plasma sintering (SPS):1||Spherical agglomerate:1||Spray pyrolysis:1||Stacking fault energy:1||Steel:1||Strain energy:1||Strontium Ferrite:1||Surface energy:1||Surface energy (anisotropy):1||Surface magnetism:1||Surface plasmon resonance:1||Surfactantassisted wet compaction:1||TEMPERATUREDEPENDENCE:1||TENSILE PROPERTIES:1||TIMICROALLOYED STEEL:1||TRIP/TWIP STEELS:1||TWINNINGINDUCED PLASTICITY:1||TWIPSTEEL:1||Tensile properties:1||Tensile strength:1||Texture:1||ThMn<sub>12</sub>:1||ThMn12:1||Thermogravimetric analysis:1||Thin film devices:1||Ti:1||Ti(C,N) precipitate:1||Ti6Al4V alloy:1||Titanium:1||Total cumulative dose:1||Transition metal oxide:1||Transmission electron microscopy (TEM):1||Twostep deposition:1||Ultrafast laser excitation:1||Ultrasonic spray pyrolysis:1||VOLUME FRACTION:1||WALLS:1||Water purification:1||Welding:1||accelerated corrosion test:1||acceleration factor:1||amorphous alloys:1||amorphous flake shape powders:1||anisotropic characteristics:1||anisotropy:1||anisotropyperpendicular:1||antenna:1||antiphase boundary:1||atom probe tomography:1||boron:1||bottomup approach:1||calcination process:1||coercivity:1||commercial pure (CP) titanium:1||composite material:1||compression test:1||core annealing temperature:1||core loss:1||coreshell nanomagnet:1||cyclic corrosion test:1||dualnozzle MEX 3D printing:1||duplex stainless steel:1||eddy current:1||electrodeposition:1||electroless plating:1||equalchannel angular pressing:1||exchange coupling:1||fabrication process:1||ferrimagnetic materials:1||ferrite:1||ferromagnetic ink:1||ferromagnetic nanowires:1||fiber:1||flaw detection:1||flow softening:1||g factor:1||gas atomization:1||gasatomization:1||glass forming ability:1||grain boundary segregation:1||grain growth:1||grain oriented silicon steel:1||grainoriented (GO) silicon steel:1||grainoriented silicon steel:1||heat treatment:1||high frequency magnetic materials:1||high manganese austenite steel:1||high temperature workability:1||highfrequency softmagnetic property:1||hollow fibers:1||inductive transducers:1||interfacial defect:1||intergranular phase:1||intermediate heat treatment:1||iron loss:1||ironpalladium:1||low temperature heat treatment:1||low temperature phase (LTP) of MnBi:1||lowenergy ball milling:1||lowprofile ferrite core:1||magnetic domain wall:1||magnetic domains:1||magnetic film devices:1||magnetic films:1||magnetic grating:1||magnetic materials:1||magnetic nanoparticle:1||magnetic powder:1||magnetic powder cores:1||magnetic semiconductors:1||magnetic thin film inductor:1||magnetooptical Kerr effect:1||manganese phosphate:1||mechanical properties:1||mechanical twins:1||melt spinning:1||meltspinning:1||metalinsulatormetal structure:1||microstrip line:1||microstructural analysis:1||microstructure characterization:1||microwave:1||mobile antenna substrate:1||modified 9Cr2W steel:1||molten salt method:1||nanocrystalline grains:1||nanocomposite:1||nanocomposite magnet:1||nanocrystalline materials:1||nanoparticle:1||nanowire:1||noise suppressor:1||oblique deposition method:1||onepot synthesis:1||outdoor corrosion test:1||parasitic resistance:1||permanent magnets:1||phase stability:1||phase transformation:1||polymer:1||postannealing:1||powder processing:1||power loss:1||preannealing temperature:1||quality factor:1||radiation effects:1||rapid solidification:1||rapid solidification process (RSP):1||rareearth free magnet:1||rareearth lean magnet:1||rareearth magnet:1||rareearth materials:1||reductiondiffusion process:1||salt spray test:1||samarium cobalt:1||sandwich:1||saturated magnetization:1||sensors:1||severe plastic deformation:1||shape tuning:1||singlecrystalline powder:1||sintering:1||sizedependent coercivity:1||soft magnetic composites:1||soft magnetic composites (SMCs):1||soft magnetic film:1||soft magnetic materials:1||soft magnetic powder:1||soft magnetic properties:1||soft magnetic thin films:1||soft magnetism:1||softmagnetic composite:1||spacer layer:1||spark plasma sintering:1||spin resonance:1||spring magnet:1||structural analysis:1||surfactant:1||thickness effect:1||thickness effects:1||thin film:1||thin film devices:1||total loss:1||total resistance:1||transmission electron microscopy analysis:1||ultrasonic spray pyrolysis:1||ultrasonic spray pyrolysis (USP):1||ultrasonication:1||wedge:1||영구자석:1||(BH)(max):1||희토류:1||75.30.Gw:1||75.75.+a:1||81.07.Bc:1||81.40.Rs:1||9CR1.8W0.5MOVNB STEEL:1||ALLOY:1||ALLOYSTEELS:1||ALUMINUM:1||ANISOTROPY:1||ARRAYS:1||AUSTENITIC STAINLESSSTEEL:1||AUSTENITIC STEEL:1||Activation energy:1||Aging:1||AlNiCo:1||Annealing process:1||Anodized aluminum oxide:1||Antioxidant Shell:1||Antiphase boundary:1||B content:1||B2 and:1||BEHAVIOR:1||BIOMEDICAL APPLICATIONS:1||Ball milling process:1||Barium compounds:1||Barium hexaferrite:1||Bead milling:1||Bending fatigue property:1||Bimetallic alloy nanoparticles:1||Bimodal powder:1||Bipolar Plates:1||Boron:1||Boron segregation:1||Boronmodified 9Cr2Wsteel:1||CARBON DISTRIBUTION:1||CIGS:1||CMOS bulk process:1||COPLANAR WAVEGUIDES:1||COPPER NANOPARTICLES:1||CREEPBEHAVIOR:1||Calcination:1||Carbides:1||Carbon Coating:1||Carburization:1||Carburized steel:1||Clustering effect:1||Coercivity:1||Coercivity, Saturation magnetization:1||Coils:1||Combustion:1||Compounds:1||Conductive Ink:1||Copper:1||Copper filling electroplating:1||Copper nanoparticle:1||CoreShell:1||Coreshell nanocomposites:1||Coreshell structure:1||Corrosion Resistivity:1||Creep:1||Cryomilling process:1||Crystal anisotropy:1||

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