Dependence of device performances on fin dimensions in AlGaN/GaN recessed-gate nanoscale FinFET
DC Field | Value | Language |
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dc.contributor.author | Yoo, G.M. | - |
dc.contributor.author | Seo, J.H. | - |
dc.contributor.author | Yoon, Y.J. | - |
dc.contributor.author | Kim, Y.J. | - |
dc.contributor.author | Kim, S.Y. | - |
dc.contributor.author | Kang, H.S. | - |
dc.contributor.author | Eun, H.R. | - |
dc.contributor.author | Kwon, R.H. | - |
dc.contributor.author | Jang, Y.I. | - |
dc.contributor.author | Kang, I.M. | - |
dc.contributor.author | Lee, S.M. | - |
dc.contributor.author | Cho, S. | - |
dc.date.available | 2020-02-28T18:45:30Z | - |
dc.date.created | 2020-02-12 | - |
dc.date.issued | 2014 | - |
dc.identifier.issn | 0000-0000 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/13040 | - |
dc.description.abstract | In this work, dependence of device performances on AlGaN/GaN heterostructure recessed-gate fin-shaped-channel field-effect transistor (FinFET), as a power transistor, on the fin dimensions is closely investigated. On-state (Ion) and off-state (Ioff) currents are affected by fin geometry and the former showed a more drastic change (250∼1209 mA/mm) compared with the latter (confined to ∼1×10-12 mA/mm order). The design works have been conducted through a three-dimensional (3-D) technology computer-aided design (TCAD). © 2014 IEEE. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers Inc. | - |
dc.relation.isPartOf | Proceedings of the International Symposium on Consumer Electronics, ISCE | - |
dc.subject | Computer aided design | - |
dc.subject | Consumer electronics | - |
dc.subject | Field effect transistors | - |
dc.subject | Gallium nitride | - |
dc.subject | Heterojunctions | - |
dc.subject | Integrated circuits | - |
dc.subject | Power electronics | - |
dc.subject | Transistors | - |
dc.subject | 3-D TCAD | - |
dc.subject | fin-shaped channel | - |
dc.subject | FinFET | - |
dc.subject | GaN | - |
dc.subject | Power transistors | - |
dc.subject | Recessed gate | - |
dc.subject | Fins (heat exchange) | - |
dc.title | Dependence of device performances on fin dimensions in AlGaN/GaN recessed-gate nanoscale FinFET | - |
dc.type | Article | - |
dc.type.rims | ART | - |
dc.description.journalClass | 1 | - |
dc.identifier.doi | 10.1109/ISCE.2014.6884475 | - |
dc.identifier.bibliographicCitation | Proceedings of the International Symposium on Consumer Electronics, ISCE | - |
dc.identifier.scopusid | 2-s2.0-84907415533 | - |
dc.citation.title | Proceedings of the International Symposium on Consumer Electronics, ISCE | - |
dc.contributor.affiliatedAuthor | Lee, S.M. | - |
dc.contributor.affiliatedAuthor | Cho, S. | - |
dc.type.docType | Conference Paper | - |
dc.subject.keywordAuthor | 3-D TCAD | - |
dc.subject.keywordAuthor | fin design | - |
dc.subject.keywordAuthor | fin-shaped channel | - |
dc.subject.keywordAuthor | FinFET | - |
dc.subject.keywordAuthor | GaN | - |
dc.subject.keywordAuthor | heterostructures | - |
dc.subject.keywordAuthor | power transistor | - |
dc.subject.keywordAuthor | recessed gate | - |
dc.subject.keywordPlus | Computer aided design | - |
dc.subject.keywordPlus | Consumer electronics | - |
dc.subject.keywordPlus | Field effect transistors | - |
dc.subject.keywordPlus | Gallium nitride | - |
dc.subject.keywordPlus | Heterojunctions | - |
dc.subject.keywordPlus | Integrated circuits | - |
dc.subject.keywordPlus | Power electronics | - |
dc.subject.keywordPlus | Transistors | - |
dc.subject.keywordPlus | 3-D TCAD | - |
dc.subject.keywordPlus | fin-shaped channel | - |
dc.subject.keywordPlus | FinFET | - |
dc.subject.keywordPlus | GaN | - |
dc.subject.keywordPlus | Power transistors | - |
dc.subject.keywordPlus | Recessed gate | - |
dc.subject.keywordPlus | Fins (heat exchange) | - |
dc.description.journalRegisteredClass | scopus | - |
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