Improved Adhesion of Metal Electrode Layer on Si3N4 Substrate through an All-Wet Process
- Authors
- Kim, Danbi; Eom, Nu Si A.; Kim, Jiwon; Lee, Kyu Hyoung; Park, Sung Heum; Lee, Ju Ho; Chao, Yong-Ho; Lim, Jae-Hong
- Issue Date
- 1-Mar-2019
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.8, no.2, pp.P159 - P164
- Journal Title
- ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY
- Volume
- 8
- Number
- 2
- Start Page
- P159
- End Page
- P164
- URI
- https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/1736
- DOI
- 10.1149/2.0171901jss
- ISSN
- 2162-8769
- Abstract
- Electroless deposition requires preliminary surface treatment to effectively adsorb a metal electrode layer onto a ceramic substrate. Herein, a simple surface treatment using an all-wet process was performed to achieve adhesion stability between a Si3N4 substrate and Ni film. The method involved deposition of an interfacial Pd-TiO2 buffer between the two layers. Surface pretreatment via silanization was initially performed to improve surface wettability, thereby enhancing uniform deposition of Pd-TiO2. Subsequently, a thin Ni layer was directly deposited onto the Pd-TiO2 layer without necessitating sensitization or activation. The synthesized Ni/Pd-TiO2/Si3N4 heat sink exhibited excellent adhesion property in the cross-hatch, scratch, and thermal shock tests. The mechanism of adhesion enhancement involved chemical bonding of Pd-TiO2 with the self-assembled monolayer on the substrate and reduced internal stress due to removal of residual hydrogen between the layers of the heat sink. Thus, the fabricated heat sink has a promising application in electronic devices operated at high temperatures. (C) 2019 The Electrochemical Society.
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