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Double-Gate Junctionless 1T DRAM with Physical Barriers for Retention Improvement

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dc.contributor.authorAnsari M.H.R.-
dc.contributor.authorNavlakha N.-
dc.contributor.authorLee J.Y.-
dc.contributor.authorCho S.-
dc.date.available2020-04-20T08:35:13Z-
dc.date.created2020-04-16-
dc.date.issued2020-04-
dc.identifier.issn0018-9383-
dc.identifier.urihttps://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/27646-
dc.description.abstractIn this article, a double-gate (DG) junctionless (JL) transistor with physical barriers is proposed for one-transistor dynamic random-access memory (1T DRAM) application. In this topology, the holes are stored in the region blocked by physical barriers constructed by oxides underneath the source and drain regions rather than a potential well formed by n+-p-n+ as in the conventional structures. The proposed topology achieves an elongated retention time ( {T}_{\text {ret}} ) with larger physical barrier thickness ( {T}_{\text {oxPB}} ) and wider barrier offset length ( {L}_{\text {BO}} ) due to a reduction in band-to-band tunneling (BTBT) (during hold '0') and recombination (during hold '1'). Maximum retention times of 2.5 s and 33 ms have been achieved for channel doping of 1019 cm-3 at 27 °C and 85 °C, respectively, with gate length ( {L}_{g} ) of 100 nm at small drain bias ( {V}_{\text {DS}} ) of 1 V during write '1.' Results demonstrate a better gate length scalability and a retention time of 4 ms at {L}_{g} of 15 nm with thinner Si channel thickness under the gate ( {T}_{\text {Si}} ) and thicker {T}_{\text {oxPB}}. In addition, the effect of temperature on retention time has been analyzed. With optimized {T}_{\text {oxPB}} at {L}_{g} = {100} nm, the retention time decreases due to thermal generation and recombination from 2.5 s at 27 °C to 3 ms at 125 °C. © 1963-2012 IEEE.-
dc.language영어-
dc.language.isoen-
dc.publisherInstitute of Electrical and Electronics Engineers Inc.-
dc.relation.isPartOfIEEE Transactions on Electron Devices-
dc.titleDouble-Gate Junctionless 1T DRAM with Physical Barriers for Retention Improvement-
dc.typeArticle-
dc.type.rimsART-
dc.description.journalClass1-
dc.identifier.wosid000522559000012-
dc.identifier.doi10.1109/TED.2020.2976638-
dc.identifier.bibliographicCitationIEEE Transactions on Electron Devices, v.67, no.4, pp.1471 - 1479-
dc.description.isOpenAccessN-
dc.identifier.scopusid2-s2.0-85082851115-
dc.citation.endPage1479-
dc.citation.startPage1471-
dc.citation.titleIEEE Transactions on Electron Devices-
dc.citation.volume67-
dc.citation.number4-
dc.contributor.affiliatedAuthorAnsari M.H.R.-
dc.contributor.affiliatedAuthorLee J.Y.-
dc.contributor.affiliatedAuthorCho S.-
dc.type.docTypeArticle-
dc.subject.keywordAuthorDouble-gate (DG) junctionless (JL) transistor-
dc.subject.keywordAuthorOne-transistor dynamic random-access memory (1T DRAM)-
dc.subject.keywordAuthorPhysical barrier-
dc.subject.keywordAuthorRetention time-
dc.subject.keywordAuthorTemperature effect-
dc.subject.keywordPlusDynamics-
dc.subject.keywordPlusSilicon-
dc.subject.keywordPlusTemperature-
dc.subject.keywordPlusThermal effects-
dc.subject.keywordPlusTopology-
dc.subject.keywordPlusTransistors-
dc.subject.keywordPlusConventional structures-
dc.subject.keywordPlusEffect of temperature-
dc.subject.keywordPlusJunctionless transistor-
dc.subject.keywordPlusOne-transistor dynamic random access memory (1t-dram)-
dc.subject.keywordPlusPhysical barriers-
dc.subject.keywordPlusRetention improvement-
dc.subject.keywordPlusRetention time-
dc.subject.keywordPlusSi channel thickness-
dc.subject.keywordPlusDynamic random access storage-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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