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A novel proessing technique for reducing contact resistance of n+ Si junctions by a high-κ dielectric prepared by atomic layer deposition

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dc.contributor.author조성재-
dc.date.available2020-04-24T07:38:20Z-
dc.date.issued2015-02-12-
dc.identifier.urihttps://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/28916-
dc.titleA novel proessing technique for reducing contact resistance of n+ Si junctions by a high-κ dielectric prepared by atomic layer deposition-
dc.typeConference-
dc.citation.conferenceNameThe 22nd Korean Conference on Semiconductors (KCS 2015)-
dc.citation.conferencePlace대한민국-
dc.citation.conferencePlace인천 송도컨벤시아-
dc.citation.endPage420-
dc.citation.startPage420-
dc.citation.titleKCS 2015 Proceedings-
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