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Effects of the Alternating Motion of Substrate on ITO Wet Etch Process in an In-Line Equipment
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 조의식 | - |
| dc.date.available | 2020-04-24T18:42:59Z | - |
| dc.date.issued | 2008-08-20 | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/35240 | - |
| dc.title | Effects of the Alternating Motion of Substrate on ITO Wet Etch Process in an In-Line Equipment | - |
| dc.title.alternative | Effects of the Alternating Motion of Substrate on ITO Wet Etch Process in an In-Line Equipment | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | The 1st International Conference on Microelectronics and plasma Technology | - |
| dc.citation.conferencePlace | 대한민국 | - |
| dc.citation.conferencePlace | Ramada Plaza Jeju Hotel, Jeju, Korea | - |
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Collections - IT융합대학 > 전자공학과 > 2. Conference Papers
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