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트리잉 파괴에 대한 와이블 확률 분포를 이용한 수명 평가
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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 김경환 | - |
| dc.date.available | 2020-04-25T05:40:03Z | - |
| dc.identifier.uri | https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/38682 | - |
| dc.title | 트리잉 파괴에 대한 와이블 확률 분포를 이용한 수명 평가 | - |
| dc.type | Conference | - |
| dc.citation.conferenceName | 한국전기전자재료학회 | - |
| dc.citation.conferencePlace | South Korea | - |
| dc.citation.endPage | 623 | - |
| dc.citation.startPage | 620 | - |
| dc.citation.title | 한국전기전자재료학회 2000년도 하계학술대회 논문집 | - |
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Collections - IT융합대학 > 전기공학과 > 2. Conference Papers
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Related Researcher
- Kim, Kyung Hwan
- College of IT Convergence (Department of Electrical Engineering)