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Thermoelectric transport properties of n-Type Sb-doped (Hf, Zr, Ti)NiSn half-heusler alloys prepared by temperature-regulated melt spinning and spark plasma sintering

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dc.contributor.authorBae, K.W.-
dc.contributor.authorHwang, J.Y.-
dc.contributor.authorKim, S.-I.-
dc.contributor.authorJeong, H.M.-
dc.contributor.authorKim, S.-
dc.contributor.authorLim, J.-H.-
dc.contributor.authorKim, H.-S.-
dc.contributor.authorLee, K.H.-
dc.date.available2020-08-25T05:35:40Z-
dc.date.created2020-08-10-
dc.date.issued2020-07-
dc.identifier.issn2076-3417-
dc.identifier.urihttps://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/78039-
dc.description.abstractHereinwereport a significantly reduced lattice thermal conductivity of Sb-doped Hf0.35Zr0.35 Ti0.3NiSn half-Heusler alloys with sub-micron grains (grain size of ~300 nm). Polycrystalline bulks of Hf0.35Zr0.35Ti0.3NiSn1-xSbx (x = 0.01, 0.02, 0.03) with a complete single half-Heusler phase are prepared using temperature-regulated melt spinning and subsequent spark plasma sintering without a long annealing process. In these submicron-grained bulks, a very low lattice thermal conductivity value of ~2.4Wm-1 K-1 is obtained at 300 K due to the intensified phonon scatterings by highly dense grain boundaries and point-defects (Zr and Ti substituted at Hf-sites). A maximum thermoelectric figure of merit, zT, of 0.5 at 800 K is obtained in Hf0.35Zr0.35Ti0.3NiSn0.99Sb0.01. © 2020 by the authors.-
dc.language영어-
dc.language.isoen-
dc.publisherMDPI AG-
dc.relation.isPartOfApplied Sciences (Switzerland)-
dc.titleThermoelectric transport properties of n-Type Sb-doped (Hf, Zr, Ti)NiSn half-heusler alloys prepared by temperature-regulated melt spinning and spark plasma sintering-
dc.typeArticle-
dc.type.rimsART-
dc.description.journalClass1-
dc.identifier.wosid000558017700001-
dc.identifier.doi10.3390/app10144963-
dc.identifier.bibliographicCitationApplied Sciences (Switzerland), v.10, no.14-
dc.description.isOpenAccessN-
dc.identifier.scopusid2-s2.0-85088562438-
dc.citation.titleApplied Sciences (Switzerland)-
dc.citation.volume10-
dc.citation.number14-
dc.contributor.affiliatedAuthorLim, J.-H.-
dc.type.docTypeArticle-
dc.subject.keywordAuthorHalf-Heusler-
dc.subject.keywordAuthorSub-micron grain-
dc.subject.keywordAuthorThermal conductivity-
dc.subject.keywordAuthorThermoelectric-
dc.subject.keywordAuthorTiNiSn-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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