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Cited 15 time in webofscience Cited 24 time in scopus
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Automated detection and quantification of hidden voids in triplex bonding layers using active lock-in thermography

Authors
Song, HominLim, Hyung JinLee, SangminSohn, HoonYun, WonjunSong, Eunha
Issue Date
Sep-2015
Publisher
Elsevier BV
Keywords
Active lock-in thermography; Hidden void detection and quantification; Non-uniform thermal distribution compensation; Binary image processing; Empirical void size mapping
Citation
NDT and E International, v.74, pp.94 - 105
Journal Title
NDT and E International
Volume
74
Start Page
94
End Page
105
URI
https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/85368
DOI
10.1016/j.ndteint.2015.05.004
ISSN
0963-8695
Abstract
This paper presents an automated hidden void detection and quantification technique for inspecting triplex bonding layers in liquefied natural gas (LNG) carriers using active lock-in thermography. Hidden voids are first detected and visualized by an amplitude image and a series of binary image processing. Then, the sizes of the detected voids are quantified using an empirical mapping function, relating the detected void sizes to the void sizes obtained by an independent X-ray testing. The performance of the proposed technique is blind tested using two triplex specimens. The experimental results reveal that the hidden voids can be successfully detected and quantified. (C) 2015 Elsevier Ltd. All rights reserved.
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Engineering (Department of Civil & Environmental Engineering)
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