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Material-Based Approaches for the Fabrication of Stretchable Electronics

Authors
Kim, Dong ChanShim, Hyung JoonLee, WoongchanKoo, Ja HoonKim, Dae-Hyeong
Issue Date
Apr-2020
Publisher
WILEY-V C H VERLAG GMBH
Keywords
intrinsically stretchable nanocomposites; material-based approach; stretchable conductors; stretchable electronics; stretchable semiconductors
Citation
ADVANCED MATERIALS, v.32, no.15
Journal Title
ADVANCED MATERIALS
Volume
32
Number
15
URI
https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/88181
DOI
10.1002/adma.201902743
ISSN
0935-9648
Abstract
Stretchable electronics are mechanically compatible with a variety of objects, especially with the soft curvilinear contours of the human body, enabling human-friendly electronics applications that could not be achieved with conventional rigid electronics. Therefore, extensive research effort has been devoted to the development of stretchable electronics, from research on materials and unit device, to fully integrated systems. In particular, material-processing technologies that encompass the synthesis, assembly, and patterning of intrinsically stretchable electronic materials have been actively investigated and have provided many notable breakthroughs for the advancement of stretchable electronics. Here, the latest studies of such material-based approaches are reviewed, mainly focusing on intrinsically stretchable electronic nanocomposites that generally consist of conducting/semiconducting filler materials inside or on elastomer backbone matrices. Various approaches for fabricating these intrinsically stretchable electronic materials are presented, including the blending of electronic fillers into elastomer matrices, the formation of bi-layered heterogeneous electronic-layer and elastomer support-layer structures, and modifications to polymeric molecular structures in order to impart stretchability. Detailed descriptions of the various conducting/semiconducting composites prepared by each method are provided, along with their electrical/mechanical properties and examples of device applications. To conclude, a brief future outlook is presented.
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Kim, Dong Chan
Engineering (화공생명배터리공학부)
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