Interconnection Technologies for Flexible Electronics: Materials, Fabrications, and Applicationsopen access
- Authors
- Baruah, Ratul Kumar; Yoo, Hocheon; Lee, Eun Kwang
- Issue Date
- Jun-2023
- Publisher
- MDPI
- Keywords
- metal routing; flexible devices; flexible metal; flexible textile; flexible circuits; plastic substrates
- Citation
- MICROMACHINES, v.14, no.6
- Journal Title
- MICROMACHINES
- Volume
- 14
- Number
- 6
- URI
- https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/88582
- DOI
- 10.3390/mi14061131
- ISSN
- 2072-666X
- Abstract
- Flexible electronic devices require metal interconnects to facilitate the flow of electrical signals among the device components, ensuring its proper functionality. There are multiple factors to consider when designing metal interconnects for flexible electronics, including their conductivity, flexibility, reliability, and cost. This article provides an overview of recent endeavors to create flexible electronic devices through different metal interconnect approaches, with a focus on materials and structural aspects. Additionally, the article discusses emerging flexible applications, such as e-textiles and flexible batteries, as essential considerations.
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Collections - IT융합대학 > 전자공학과 > 1. Journal Articles
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