Sequential Residual Learning for Multistep Processes in Semiconductor Manufacturing
- Authors
- Lee, Gyeong Taek; Lim, Hyeong Gu; Jang, Jaeyeon
- Issue Date
- Feb-2023
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- Sequential residual learning; semiconductor manufacturing; fault detection; multistep process
- Citation
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.36, no.1, pp 37 - 44
- Pages
- 8
- Journal Title
- IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING
- Volume
- 36
- Number
- 1
- Start Page
- 37
- End Page
- 44
- URI
- https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/90766
- DOI
- 10.1109/TSM.2022.3226716
- ISSN
- 0894-6507
1558-2345
- Abstract
- Semiconductor manufacturing consists of multiple sequential processes. In addition, even in a single process, a wafer must pass several steps. Accordingly, a dataset generated in semiconductor manufacturing has sequential information. Thus, the sequential information between steps and processes must be considered when predicting a target variable such as a yield or defect status. This paper proposes a method that utilizes the concept of residual learning to capture sequential information. Specifically, we propose to learn several modules that use data gathered starting from different steps and obtain a final decision by combining all modules' decisions. In each module including multiple models, the first model is trained to predict the target variable using the data from the earliest step, and the remaining models are trained to predict the residuals that cannot be explained by the models for the previous steps based on the concept of residual learning. We conducted extensive experiments using two real-world semiconductor manufacturing datasets and found that even though each module's performance was not good, the final decision obtained by combining all the modules' decisions achieved a significant performance improvement. As a result, the proposed method significantly outperformed the baseline models.
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