Gradual bipolar resistive switching in Ni/Si3N4/n(+)-Si resistive-switching memory device for high-density integration and low-power applications
- Authors
- Kim, Sungjun; Jung, Sunghun; Kim, Min-Hwi; Cho, Seongjae; Park, Byung-Gook
- Issue Date
- Dec-2015
- Publisher
- PERGAMON-ELSEVIER SCIENCE LTD
- Keywords
- Si3N4-based RRAM; Resistive switching; Abrupt reset; Gradual reset; Multi-level cell (MLC); Space-charge-limited current (SCLC)
- Citation
- SOLID-STATE ELECTRONICS, v.114, pp.94 - 97
- Journal Title
- SOLID-STATE ELECTRONICS
- Volume
- 114
- Start Page
- 94
- End Page
- 97
- URI
- https://scholarworks.bwise.kr/gachon/handle/2020.sw.gachon/9837
- DOI
- 10.1016/j.sse.2015.08.003
- ISSN
- 0038-1101
- Abstract
- In this work, we report a gradual bipolar resistive switching memory device using Ni/Si(3)N(4/)n(+)-Si structure. Different reset transitions are observed depending on compliance current (I-COMP). The reset switching becomes abrupt around I-COMP = 10 mA, while gradual reset switching with fine controllability is preserved for the devices with I-COMP < 1 mA. We demonstrate multi-level cell (MLC) operation through the modulation of conducting path by controlling I-COMP and reset stop voltage (V-STOP) for I-COMP < 1 mA. For the devices with I-COMP = 10 mA, low resistance state (LRS) shows Ohmic behavior with metallic conducting paths, while high resistance state (HRS) shows non-Ohmic behavior. Also, it is revealed that LRS and HRS conductions follow space-charge-limited current (SCLC) mechanism in low I-COMP regime (I-COMP < 1 mA). (C) 2015 Elsevier Ltd. All rights reserved.
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