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Effects of interfacial layer-by-layer nanolayers on the stability of the Cu TSV:Diffusion barrier, adhesion, conformal coating, and mechanical propertyGo to Link

Jeong, Daekyun; Abdur, Rahim; Joo, Young-Chang; Jang, Jae-il; Cha, Pil Ryung; Kim, Jiyoung; Min, Kyeong-Sik; Lee, Jaegab

ArticleIssue Date2018CitationMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, v.83, pp.33 - 41PublisherELSEVIER SCI LTD
SCISCIESCOPUS
Mechanical and electrical stability of PEDOT: PTS and Au source/drain electrodes for bottom contact OTFTs on plastic films under bending conditionsGo to Link

Abdur, Rahim; Lee, Young Kyu; Jeong, Kyunghoon; Nam, Ho-Seok; Kim, Young-Ho; Kim, Jiyoung; Lee, Jaegab

ArticleIssue Date2015CitationOrganic Electronics, v.26, pp 8 - 14PublisherElsevier BV
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