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Low-damage etching of poly-Si and SiO<sub>2</sub> via a low-energy electron beam in inductively coupled CF<sub>4</sub> plasmaGo to Link

Jung, Jiwon; Kim, Jae-Hwi; Lim, Chang-Min; Choi, Jung-Eun; Bae, Junil; Kim, Hyung-Dong; Chung, Chin-Wook

ArticleIssue Date2024CitationPLASMA SOURCES SCIENCE & TECHNOLOGY, v.33, no.10, pp 1 - 10PublisherIOP Publishing Ltd
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