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A new COP bonding using non-conductive adhesives for LCDs driver IC packagingGo to Link

Chen, Zhi Gang; Kim, Young-Ho

ArticleIssue Date2006CitationDisplays, v.27, no.3, pp 130 - 135PublisherElsevier BV
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Characteristics of the interfacial microstructure of chip-on-plastic joints under thermal cycling and aging treatmentGo to Link

Chen, Zhi Gang; Kim, Young Ho

ArticleIssue Date2007CitationJournal of Electronic Materials, v.36, no.1, pp 45 - 55PublisherInstitute of Electrical and Electronics Engineers
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