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Showing results 1 to 2 of 2
SCIE
SCOPUS
A new COP bonding using non-conductive adhesives for LCDs driver IC packaging
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Chen, Zhi Gang; Kim, Young-Ho
Article
Issue Date
2006
Citation
DISPLAYS, v.27, no.3, pp.130 - 135
Publisher
ELSEVIER
SCIE
SCOPUS
Characteristics of the interfacial microstructure of chip-on-plastic joints under thermal cycling and aging treatment
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Chen, Zhi Gang; Kim, Young Ho
Article
Issue Date
2007
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.36, no.1, pp.45 - 55
Publisher
SPRINGER
1
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