Characteristics of the interfacial microstructure of chip-on-plastic joints under thermal cycling and aging treatment
- Authors
- Chen, Zhi Gang; Kim, Young Ho
- Issue Date
- Jan-2007
- Publisher
- SPRINGER
- Keywords
- flip chip; nonconductive adhesives (NCAs); thermal cycling (T/C); aging; intermetallic compounds (IMCs)
- Citation
- JOURNAL OF ELECTRONIC MATERIALS, v.36, no.1, pp.45 - 55
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF ELECTRONIC MATERIALS
- Volume
- 36
- Number
- 1
- Start Page
- 45
- End Page
- 55
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/180585
- DOI
- 10.1007/s11664-006-0022-3
- ISSN
- 0361-5235
- Abstract
- This study presents the change of contact resistance and microstructure evolution of chip-on-plastic (COP) joints during the thermal cycling (T/C) test and aging treatment. Results showed that the average contact resistance of COP joints decreased in the early stage of the T/C test as well as during aging treatment. It was observed that after 1,000 h of aging, the (Cu, Au)(3)Sn phase was completely consumed and transformed into (Cu, Au)(6)Sn-5. The dependence of the growth of interfacial intermetallic compounds (IMCs) on the time of T/C and aging was investigated. The IMC growth had parabolic kinetics with time. The time exponent n under the condition of T/C was approximately 0.5, which indicated that the IMC growth was diffusion controlled. However, the fitting results on the aging treatment showed that n was only about 0.37. The reason for this finding is considered to be due to the fact that after 250 h, the Cu in some areas was depleted; thus, the diffusion in these areas was restrained.
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