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A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip applicationGo to Link

Cho, Hae-Young; Kim, Tae-Jin; Kim, Young Min; Kim, Sun-Chul; Park, Jin-Young; Kim, Young Ho

ArticleIssue Date2010CitationProceedings - Electronic Components and Technology Conference, pp 151 - 155
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