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Fabrication of copper nanoparticles in 6FDA-ODA polyimide filmGo to Link

Choi, Dong Joo; Ahnn, Key-one; Choi, Min Young; Kim, Young Ho

ArticleIssue Date2012Citation2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011, pp 517 - 517PublisherIEEE
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Fabrication of Copper Nanoparticles in a Thick Polyimide Film Cured by Rapid Thermal AnnealingGo to Link

Choi, Min Young; Choi, Dong Joo; Ahn, Key-One; Ro, Insoo; Kim, Young-Ho; Suh, Sang-Hee

ArticleIssue Date2012CitationJournal of Nanoscience and Nanotechnology, v.12, no.4, pp 3637 - 3640PublisherAmerican Scientific Publishers
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Interfacial reactions between Sn-3.0Ag-0.5Cu solder and Cu-xZn (x=0-35 wt%) or Cu-xZn-yNi (x=20 and 25 wt%, y=15 and 10 wt%) substratesGo to Link

Kim, Young Min; Kim, Tae Jin; Choi, Min Young; Kim, Young-Ho

ArticleIssue Date2013CitationJournal of Alloys and Compounds, v.575, pp 350 - 358PublisherElsevier BV
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