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Fabrication of copper nanoparticles in 6FDA-ODA polyimide film
- Issue Date
- Feb-2012
- Publisher
- IEEE
- Citation
- 2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011, pp 517 - 517
- Pages
- 1
- Indexed
- SCOPUS
- Journal Title
- 2011 IEEE Nanotechnology Materials and Devices Conference, NMDC 2011
- Start Page
- 517
- End Page
- 517
- Abstract
- We investigate the formation of Cu nanoparticles in a polyimide (PI) film. The Cu nanoparticles were uniformly dispersed in the PI film by curing a precursor of PI, polyamic acid (PAA) containing Cu ions. The PAA was imidized to PI at 350°C for 2 hours in forming gas (5% H 2+95% N 2), accompanying the nanoparticle precipitation. X-ray diffracton patterns revealed that Cu nanoparticles formed by curing in a reducing atmosphere, and transmission electron microscopy showed that about 5 nm sized Cu nanoparticles were dispersed in the PI film.
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