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Mixed mode fracture toughness of epoxy molding compound/ printed circuit board interface of semiconductor packages with respect to temperature and moistureGo to Link

Um, Hui-Jin; Lee, Se-Min; Lee, Dae-Woong; Ha, Sangyul; Kim, Hak-Sung

ArticleIssue Date2023CitationEngineering Fracture Mechanics, v.289, pp 1 - 14PublisherPergamon Press Ltd.
SCIESCOPUS
Oxidation Damage Evolution in Low-Cycle Fatigue Life of Niobium-Stabilized Austenitic Stainless SteelGo to Linkopen access

Choi, Wan-Kyu; Ha, Sangyul; Kim, Jong-Cheon; Park, Jong-Cheon; Gong, Aokai; Kim, Tae-Won

ArticleIssue Date2022CitationMATERIALS, v.15, no.12, pp 1 - 21PublisherMDPI
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