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Characterization of Cu-Mn/Ta Layer as Cu Diffusion Barrier on a Low-k Dielectric Go to Link

Kang, Min-Soo; Park, Jae-Hyung; Han, Dong-Suk; Jeon, Hyeong-Tag; Park, Jong-Wan

ArticleIssue Date2016CitationJournal of Nanoscience and Nanotechnology, v.16, no.10, pp 10908 - 10912PublisherAmerican Scientific Publishers

SCISCIESCOPUS

Influence of molybdenum source/drain electrode contact resistance in amorphous zinc-tin-oxide (a-ZTO) thin film transistors Go to Link

Han, Dong-Suk; Kang, Yu-Jin; Park, Jae-Hyung; Jeon, Hyung-Tag; Park, Jong-Wan

ArticleIssue Date2014CitationMaterials Research Bulletin, v.58, pp 174 - 177PublisherPergamon Press Ltd.

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Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating Go to Link

Park, Jae-Hyung; Moon, Dae-Yong; Han, Dong-Suk; Kang, Yu-Jin; Shin, So-Ra; Jeon, Hyung-Tag; Park, Jong-Wan

ArticleIssue Date2014CitationSurface and Coatings Technology, v.259, pp 98 - 101PublisherElsevier BV

SCISCIESCOPUS

Self-forming VOx layer as Cu diffusion barrier for low-k dielectrics Go to Link

Park, Jae-Hyung; Han, Dong-Suk; Kang, Yu-Jin; Shin, So-Ra; Jeon, Hyung-Tag; Park, Jong-Wan

ArticleIssue Date2014CitationSurface and Coatings Technology, v.259, pp 252 - 256PublisherElsevier BV

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Browsing by Han, Dong-SukAuthor

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