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Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random VibrationGo to Linkopen access

Lee, Jisup; Jeong, Hyunsik; Jang, Gunhee

ArticleIssue Date2024CitationMaterials, v.17, no.3, pp 1 - 13PublisherMDPI Open Access Publishing
SCIESCOPUS
Shear test evaluation of the mechanical reliability of micro bumps in semiconductorsGo to Link

Cho, Yeungjung; Hahn, Mibbeum; Jeong, Hyunsik; Jang, Gunhee

ArticleIssue Date2021CitationMICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, v.28, no.SI 10, pp 2173 - 2180PublisherSPRINGER HEIDELBERG
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