Optimization of the Boundary Conditions of a Board Level Reliability Test Board to Maximize the Fatigue Life of Ball Grid Array Solder Joints under Thermal Cycling and Random Vibration

Abstract

We investigated the screw hole position of a board level reliability (BLR) test board to improve the fatigue reliability of solder joints under thermal cycling and random vibration. We developed a finite element model of a BLR test board and derived the plastic strain energy density and 1-sigma stress, which are the main parameters influencing the fatigue life of solder joints under thermal cycling and random vibration, respectively. We analyzed the correlation between the screw hole position and the main parameters of the fatigue life through sensitivity analysis. By performing multi-objective optimization, we determined the screw hole position that maximizes the fatigue life of solder joints under thermal cycling and random vibration. With the optimal screw hole position, the fatigue life significantly increased under thermal cycling and random vibration compared to the BLR test board with the initial screw hole position.