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Effect of alkaline agent in colloidal silica slurry for polycrystalline silicon chemical mechanical polishing Go to Link

Lee, Myung Yoon; Kang, Hyun Goo; Kanemoto, Manabu; Paik, Ungyu; Park, Jea Gun

ArticleIssue Date2007CitationJapanese Journal of Applied Physics, v.46, no.8A, pp 5089 - 5094PublisherIOP Publishing Ltd

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Effects of abrasive particle size and molecular weight of poly(acrylic acid) in ceria slurry on removal selectivity of SiO2/Si3N4 films in shallow trench isolation chemical mechanical planarization Go to Link

Kang, Hyun Goo; Park, Hyung Soon; Paik, Ungyu; Park, Jea Gun

ArticleIssue Date2007CitationJournal of Materials Research, v.22, no.3, pp 777 - 787PublisherMaterials Research Society

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Effects of the size and the concentration of the abrasive in a colloidal silica (SiO2) slurry with added TMAH on removal selectivity of polysilicon and oxide films in polysilicon chemical mechanical polishing Go to Link

Park, Kyung Woong; Kang, Hyun Goo; Kanemoto, Manabu; Park, Jea Gun; Paik, Ungyu

ArticleIssue Date2007CitationJournal of the Korean Physical Society, v.51, no.1, pp 214 - 223Publisher한국물리학회

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Browsing by Kang, Hyun GooAuthor

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