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Showing results 1 to 16 of 16

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3D-Printable toe-joint design of prosthetic footGo to Link

Um, Hui-Jin; Kim, Heon-Su; Hong, Woolim; Kim, Hak-Sung; Hur, Pilwon

ArticleIssue Date2021Citation2021 18th International Conference on Ubiquitous Robots, UR 2021, pp.9 - 13PublisherInstitute of Electrical and Electronics Engineers Inc.
SCIESCOPUS
Design of 3D printable prosthetic foot to implement nonlinear stiffness behavior of human toe joint based on finite element analysisGo to Linkopen access

Um, Hui-Jin; Kim, Heon-Su; Hong, Woolim; Kim, Hak-Sung; Hur, Pilwon

ArticleIssue Date2021CitationSCIENTIFIC REPORTS, v.11, no.1, pp.1 - 11PublisherNATURE PORTFOLIO
SCIESCOPUS
Detection of Hidden Defects inside Polymer Tubes Using Anomaly Detection with Generative Adversarial Neural Network Based on Terahertz Scanning ImagesGo to Link

Kim, Heon-Su; Kim, Sang-Il; Kim, You-Gwon; Park, Dong-Woon; Kim, Hak-Sung

ArticleIssue Date2025CitationJournal of Infrared, Millimeter, and Terahertz Waves, v.46, no.1, pp 1 - 19PublisherSpringer Verlag
SCIESCOPUS
Electron density measurement of Ar, N2, O2, and Ar mixtures (with N2 and O2) gas in inductively coupled plasma (ICP) using terahertz time domain spectroscopyGo to Link

Kim, Sang-Il; Park, Dong-Woon; Kim, Heon-Su; Kim, Hak-Sung

ArticleIssue Date2025CitationOptics & Laser Technology, v.180, pp 1 - 8PublisherElsevier Ltd
SCOPUS
Empirical Validation of an Auxetic Structured Foot with the Powered Transfemoral ProsthesisGo to Link

Hong, Woolim; Kumar, Namita Anil; Patrick, Shawanee'; Um, Hui-Jin; Kim, Heon-Su; Kim, Hak Sung; Hur, Pilwon

ArticleIssue Date2022CitationProceedings of the IEEE RAS and EMBS International Conference on Biomedical Robotics and Biomechatronics, v.2022-August, pp 1 - 8PublisherIEEE Computer Society
SCIESCOPUS
In-situ inspection of stealth laser diced internal crack lines in silicon wafer using cepstrum signal processing with terahertz electromagnetic wavesGo to Link

Kim, Sang-Il; Kim, Heon-Su; Kim, Tae-Wan; Lim, Jinsang; Han, Dong-Su; Lee, Hae Gu; Kim, Hak Sung

ArticleIssue Date2026CitationMEASUREMENT, v.262, pp 1 - 17PublisherELSEVIER SCI LTD
ESCIKCI
Inspection of Internal Defects in Ceramic-polymer-metal Composites Using Terahertz Time-Domain Spectroscopy and Deep LearningGo to Link

Kim, You-Gwon; Kim, Sang-Il; Kim, Heon-Su; Kim, Hak-Sung

ArticleIssue Date2024Citation비파괴검사학회지, v.44, no.3, pp 172 - 179Publisher한국비파괴검사학회
SCOPUS
NON-DESTRUCTIVE DETECTION OF MICRO DELAMINATION IN GLASS FIBER REINFORCED POLYMER COMPOSITES USING TERAHERTZ WAVE WITH CONVOLUTION NEURAL NETWORK

Kim, Heon-Su; Park, Dong-Woon; Kim, Sang-Il; Kim, Hak Sung

ArticleIssue Date2022CitationECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.3, pp.548 - 553PublisherComposite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)
SCOPUS
NON-DESTRUCTIVE EVALUATION FOR CRYSTALLINITY AND MOISTURE CONTENT OF POLYETHYLENE TEREPHTHALATE USING TERAHERTZ WAVE

Kim, Sang-Il; Park, Dong-Woon; Kim, Heon-Su; Kim, Hak Sung

ArticleIssue Date2022CitationECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.3, pp.554 - 559PublisherComposite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)
SCIESCOPUS
Non-destructive evaluation of cement hydration with pulsed and continuous Terahertz electro-magnetic wavesGo to Link

Kim, Heon-Su; Park, Dong-Woon; Oh, Gyung-Hwan; Kim, Hak-Sung

ArticleIssue Date2021CitationOPTICS AND LASERS IN ENGINEERING, v.138, pp.1 - 10PublisherELSEVIER SCI LTD
SCIESCOPUS
Non-destructive evaluation of thermally induced structural transformation in PET using terahertz time-domain spectroscopyGo to Linkopen access

Kim, Tae-Wan; Kim, Sang-Il; Kim, Heon-Su; Moon, Chang-Jin; Kim, Hak-Sung

ArticleIssue Date2026CitationMATERIALS TODAY ADVANCES, v.29, pp 1 - 11PublisherELSEVIER
ESCIKCI
Non-destructive Inspection Technique Using a Terahertz Wave to Inspect the Alignment of the Internal Chip in Semiconductor PackageGo to Link

Kim, Sang-Il; Kim, Heon-Su; Kim, Hak-Sung

ArticleIssue Date2024Citation비파괴검사학회지, v.44, no.3, pp 165 - 171Publisher한국비파괴검사학회
SCIESCOPUS
Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materialsGo to Linkopen access

Kim, Heon-Su; Kim, You-Gwon; Jang, Dong-Min; Jang, Jin-Woo; Lee, Seung-Yeong; Kim, Hak-Sung

ArticleIssue Date2025CitationMaterials & Design, v.254, pp 1 - 11PublisherElsevier BV
SCOPUS
Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball

Kim, You-Gwon; Kim, Heon-Su; Kim, Tae-Wan; Ryu, Seoung-Ung; Kim, Hak-Sung; Jang, Yong-Rae; Han, Bongtae; Lee, Jun-Hyeong; Kim, Jin-Kyu

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 2261 - 2266
SCOPUS
Structural design for energy absorption during heel strike using the auxetic structure in the heel part of the prosthetic footGo to Link

Kim, Heon-Su; Um, Hui-Jin; Hong, Woolim; Kim, Hak-Sung; Hur, Pilwon

ArticleIssue Date2021Citation2021 18th International Conference on Ubiquitous Robots, UR 2021, pp.130 - 133PublisherInstitute of Electrical and Electronics Engineers Inc.
SCIESCOPUS
Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performanceGo to Linkopen access

Kim, You-Gwon; Kim, Heon-Su; Kim, Tae-Wan; Park, Hyeong-Bin; Park, Jong-Whi; Jang, Yongrae; Han, Bongtae; Lee, Jun-Hyeong; Kim, Jin Gyu; Kim, Hak-Sung

ArticleIssue Date2025CitationJournal of Materials Research and Technology, v.38, pp 3632 - 3642PublisherElsevier Editora Ltda
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