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Dry plasma-enhanced adhesion of Ti/Cu seed layers to ABF substrates for fine-pitch packaging reliabilityGo to Link

Lee, Se-Min; Um, Hui-Jin; Jeon, Na-Hyun; Rho, Hyun-Ji; Jeong, Soon-Oh; Han, Young-Ju; Kim, Moo-Seong; Kim, Hak-Sung

ArticleIssue Date2026CitationApplied Surface Science, v.738, pp 1 - 13PublisherElsevier B.V.
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