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Plasma dry desmear of Ajinomoto build-up film for fine micro-via fabrication in advanced semiconductor packagingGo to Link

Kim, Gyulee; Kim, Sunbum; Min, Kyoung Yeon; Han, Young Ju; Jeong, Soonoh; Kim, Mooseong; Choi, Changhwan

ArticleIssue Date2026CitationMaterials Science in Semiconductor Processing, v.214, pp 1 - 12PublisherElsevier Ltd
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