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Reliability of Cu to Cu joints fabricated using SnAg capping layer for 3D TSV applicationsGo to Link

Ma, Sung Woo; Lee, Jeong Hwan; Lee, Jin Su; Kim, Ki Bum; Suh, Min Suk; Kim, Nam Seog; Kim, Young Ho

ArticleIssue Date2014CitationAdvanced Materials Research, v.900, pp 711 - 714PublisherTrans Tech Publications
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