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Analysis on the Adhesion Failure between Cu Metal Layer and Photosensitive Polyimide (PSPI) for 2.nD Re-Distribution Layer (RDL) ProcessGo to Link

Kim, Subum; Han, Dugkyu; Min, Kyungyeon; Choi, Changhwan

ArticleIssue Date2026CitationProceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, pp 1 - 5PublisherInstitute of Electrical and Electronics Engineers Inc.
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