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A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application Go to Link

Cho, Hae-Young; Kim, Tae-Jin; Kim, Young Min; Kim, Sun-Chul; Park, Jin-Young; Kim, Young Ho

ArticleIssue Date2010CitationProceedings - Electronic Components and Technology Conference, pp 151 - 155

SCISCIESCOPUS

A peel adhesion study of electroless Cu layers on polymer substrates Go to Link

Kim, Sun-Chul; Seong, Haseob; Ahn, Key-one; Choi, Dong Joo; Lee, Ja-Yeon; Ko, Young-Ju; Yoon, Suk-beom; Seo, Mi-lim; Kim, Young-Ho

ArticleIssue Date2018CitationJournal of Adhesion, v.94, no.1, pp 1 - 14PublisherTaylor & Francis

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An eco-friendly Cu-Zn wetting layer for highly reliable solder joints Go to Link

Kim, Young Min; Kim, Sun-Chul; Kim, Young-Ho

ArticleIssue Date2013CitationProceedings - Electronic Components and Technology Conference, pp 755 - 760

SCISCIESCOPUS

Development of chip-on-flex bonding using Sn-based bumps and non-conductive adhesive Go to Link

Harr, Kyoung-Moo; Kim, Sun-Chul; Kim, Young-Min; Kim, Young-Ho

ArticleIssue Date2015CitationMicroelectronics and Reliability, v.55, no.8, pp 1241 - 1247PublisherElsevier Ltd.

SCOPUS

Development of highly reliable flip-chip bonding technology using non-conductive adhesives (NCAs) for 20 μm pitch application Go to Link

Kim, Sun-Chul; Hong, Myung-Hwan; Lee, Ji-Hyun; Kim, Young-Ho

ArticleIssue Date2013CitationProceedings - Electronic Components and Technology Conference, pp 785 - 789

SCOPUS

Development of low temperature Chip-on-Flex (COF) bonding process of 100°C Go to Link

Kim, Sun-Chul; Kim, Young-Ho

ArticleIssue Date2013Citation14th International Conference on Electronic Materials and Packaging, EMAP 2012, pp 1 - 3PublisherIEEE

SCISCIESCOPUS

Effects of Bath Composition on the Adhesion Characteristics of Electroless Cu Layers on Epoxy-Based Polymer Substrates Go to Link

Seong, Haseob; Kim, Sun-Chul; Choi, Dong Joo; Lee, Ja-Yeon; Ko, Young-Joo; Yoon, Suk-beom; Seo, Mi-lim; Kim, Young-ho

ArticleIssue Date2016CitationJournal of the Electrochemical Society, v.163, no.6, pp D250 - D255PublisherElectrochemical Society, Inc.

SCISCIESCOPUSKCI

Flip chip bonding with anisotropic conductive film (ACF) and nonconductive adhesive (NCA)Go to Link

Kim, Sun-Chul; Kim, Young-Ho

ArticleIssue Date2013CitationCurrent Applied Physics, v.13, pp S14 - S25PublisherThe Korean Physical Society

SCISCIESCOPUS

Highly reliable, fine pitch chip on glass (COG) joints fabricated using Sn/Cu bumps and non-conductive adhesives Go to Link

Kim, Byeung-Gee; Lee, Sang-Mok; Jo, Yun-Song; Kim, Sun-Chul; Harr, Kyoung-Moo; Kim, Young-Ho

ArticleIssue Date2011CitationMicroelectronics and Reliability, v.51, no.4, pp 851 - 859PublisherElsevier Ltd.

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Low temperature chip on film bonding technology for 20 µm pitch applications Go to Link

Kim, Sun-Chul; Kim, Young-Ho

ArticleIssue Date2016CitationJournal of Materials Science: Materials in Electronics, v.27, no.4, pp 3658 - 3667PublisherKluwer Academic Publishers

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The Effect of Fillers in Nonconductive Adhesive on the Reliability of Chip-on-Glass Bonding with Sn/Cu Bumps Go to Link

Kim, Byeung Gee; Kim, Sun-Chul; Dong, Wen-Guo; Kim, Young-Ho

ArticleIssue Date2011CitationMaterials Transactions, v.52, no.11, pp 2106 - 2110PublisherJapan Institute of Metals

SCISCIESCOPUS

The effect of solder wetting on nonconductive adhesive (NCA) trapping in NCA applied flip-chip bonding Go to Link

Kim, Sun-Chul; Lee, Ja Yeon; Park, Jae-Yong; Lee, Tae-Young; Kim, Young-Ho

ArticleIssue Date2016CitationJournal of Materials Science: Materials in Electronics, v.27, no.7, pp 6646 - 6655PublisherKluwer Academic Publishers

SCISCIESCOPUSKCI

Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF)Go to Link

Hong, Myung Hwan; Kim, Sun-Chul; Kim, Young-Ho

ArticleIssue Date2012CitationCurrent Applied Physics, v.12, no.3, pp 612 - 615PublisherThe Korean Physical Society

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Browsing by Kim, Sun-ChulAuthor

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