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Inhibitor-Assisted Atomic Layer Deposition for Uniformly Doped Ultrathin Films: Overcoming Compositional and Thickness LimitationsGo to Link

Kim, Taeseok; Kim, Han; Ryu, Seung Ho; Park, Gwang Min; Kim, Sung-Chul; Lee, Sung Kwang; Chung, Taek-Mo; Won, Sung Ok; Han, Jeong Hwan; Kim, Sangtae, et al.

ArticleIssue Date2025CitationChemistry of Materials, v.37, no.2, pp 796 - 805PublisherAmerican Chemical Society
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Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bondingGo to Link

Park, Jae-Yong; Lee, Ja Yeon; Park, Hwan-Pil; Kim, Sung-Chul; Lee, Tae-Young; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2019CitationMICROELECTRONIC ENGINEERING, v.216, pp.1 - 7PublisherELSEVIER
SCIESCOPUS
Selective Surface Passivation for Ultrathin and Continuous Metallic Films via Atomic Layer DepositionGo to Link

Kim, Han; Kim, Taeseok; Kim, Minseok; Jeon, Jihoon; Park, Gwang Min; Kim, Sung-Chul; Won, Sung Ok; Harada, Ryosuke; Kim, Sangtae; Kim, Seong Keun

ArticleIssue Date2025CitationNano Letters, v.25, no.10, pp 4101 - 4107PublisherAmerican Chemical Society
SCIESCOPUS
Sustained Area-Selectivity in Atomic Layer Deposition of Ir Films: Utilization of Dual Effects of O3 in Deposition and EtchingGo to Linkopen access

Kim, Han; Kim, Taeseok; Chung, Hong Keun; Jeon, Jihoon; Kim, Sung-Chul; Won, Sung Ok; Harada, Ryosuke; Tsugawa, Tomohiro; Kim, Sangtae; Kim, Seong Keun

ArticleIssue Date2024CitationSmall, v.20, no.46, pp 1 - 8PublisherWiley - V C H Verlag GmbbH & Co.
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