ScholarWorks@Hanyang University

Browsing by Kim, Taek-HyeonAuthor

All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 1 of 1

SCIESCOPUS
Effect of electroplating current density and post-annealing on the warpage and reliability of redistribution layer for advanced semiconductor packageGo to Linkopen access

Kim, Taek-Hyeon; Baek, Jeong-Hyeon; Kim, Sang-Il; Kim, Tae-Hoon; Shim, Ji-Hye; Kim, Hak-Sung

ArticleIssue Date2025CitationMaterials & Design, v.259, pp 1 - 11PublisherElsevier BV
1
CONTACT US

RSS_1.0 RSS_2.0 ATOM_1.0

222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1366

COPYRIGHT © 2024 HANYANG UNIVERSITY.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.

BROWSE

한국어