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SCIESCOPUS
50% reduction in energy consumption in an actual cold storage facility using a deep reinforcement learning-based control algorithmGo to Link

Park, Jong-Whi; Ju, Young-Min; Kim, You-Gwon; Kim, Hak-Sung

ArticleIssue Date2023CitationApplied Energy, v.352, pp 1 - 12PublisherElsevier Ltd
SCIESCOPUS
Detection of Hidden Defects inside Polymer Tubes Using Anomaly Detection with Generative Adversarial Neural Network Based on Terahertz Scanning ImagesGo to Link

Kim, Heon-Su; Kim, Sang-Il; Kim, You-Gwon; Park, Dong-Woon; Kim, Hak-Sung

ArticleIssue Date2025CitationJournal of Infrared, Millimeter, and Terahertz Waves, v.46, no.1, pp 1 - 19PublisherSpringer Verlag
SCIESCOPUS
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder JointGo to Link

Jang, Yongrae; Kim, You-Gwon; Kim, Hak-Sung; Kim, Do-Hyung; Jang, Dong-Min; Jang, Jin-Woo; Lee, Seung-Yeong; Han, Bongtae

ArticleIssue Date2025CitationIEEE Transactions on Components, Packaging and Manufacturing Technology, v.15, no.10, pp 2152 - 2159PublisherInstitute of Electrical and Electronics Engineers Inc.
ESCIKCI
Inspection of Internal Defects in Ceramic-polymer-metal Composites Using Terahertz Time-Domain Spectroscopy and Deep LearningGo to Link

Kim, You-Gwon; Kim, Sang-Il; Kim, Heon-Su; Kim, Hak-Sung

ArticleIssue Date2024Citation비파괴검사학회지, v.44, no.3, pp 172 - 179Publisher한국비파괴검사학회
SCOPUS
MEASUREMENT OF ELECTRICAL CONDUCTIVITY AND PERCOLATION THRESHOLD OF MULTI-WALLED CARBON NANOTUBE/EPOXY COMPOSITES USING TERAHERTZ TIME DOMAIN SPECTROSCOPY

Kim, You-Gwon; Park, Dong-Woon; Kim, Hak Sung

ArticleIssue Date2022CitationECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.3, pp.574 - 579PublisherComposite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)
SCIESCOPUS
Prediction of fatigue life of semiconductor package under thermal cycling: Combined effect of package design and solder materialsGo to Linkopen access

Kim, Heon-Su; Kim, You-Gwon; Jang, Dong-Min; Jang, Jin-Woo; Lee, Seung-Yeong; Kim, Hak-Sung

ArticleIssue Date2025CitationMaterials & Design, v.254, pp 1 - 11PublisherElsevier BV
SCOPUS
Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball

Kim, You-Gwon; Kim, Heon-Su; Kim, Tae-Wan; Ryu, Seoung-Ung; Kim, Hak-Sung; Jang, Yong-Rae; Han, Bongtae; Lee, Jun-Hyeong; Kim, Jin-Kyu

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 2261 - 2266
SCIESCOPUS
Synergistic role of Bi, Ni, and Pd alloying in SAC305 for enhanced IMC suppression and superior thermo-mechanical performanceGo to Linkopen access

Kim, You-Gwon; Kim, Heon-Su; Kim, Tae-Wan; Park, Hyeong-Bin; Park, Jong-Whi; Jang, Yongrae; Han, Bongtae; Lee, Jun-Hyeong; Kim, Jin Gyu; Kim, Hak-Sung

ArticleIssue Date2025CitationJournal of Materials Research and Technology, v.38, pp 3632 - 3642PublisherElsevier Editora Ltda
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