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Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation testGo to Linkopen access

Ju, Young-Min; Kim, Dukyong; Lee, Se-Min; Kim, Heuisu; Lee, Daewoong; Hwang, Yeon-Taek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2025CitationApplied Surface Science Advances, v.28, pp 1 - 12PublisherElsevier
SCOPUS
Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package

Ju, Young-Min; Um, Hui-Jin; Lee, Se-Min; Kim, Dukyong; Yoo, Woong-Kyoo; Lee, Daewoong; Hwang, Yeontaek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 1260 - 1264
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