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Finite element analysis of moisture induced thermo-mechanical delamination of semiconductor packages considering in-situ moisture desorption during reflow processGo to Link

Hwang, Yeon-Taek; Um, Hui-Jin; Yu, Myeong-Hyeon; Lee, Dae-Woong; Lee, Mi-Jung; Kim, Hak Sung

ArticleIssue Date2021CitationMicroelectronics and Reliability, v.121, pp 1 - 13PublisherElsevier Ltd.
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