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Accuracy enhancement for airbag deployment simulations considering the strain rate and temperature-dependent mechanical properties of thermoplastic olefin and polypropylene Go to Link

Lee, Se-Min; Han, In-Soo; Kim, Gyu-Won; An, Jae-Hyun; Kim, Hak-Sung

ArticleIssue Date2024CitationComposites Part B: Engineering, v.275, pp 1 - 13PublisherPergamon Press Ltd.

SCIESCOPUS

Leptin Increases TNF-alpha Expression and Production through Phospholipase D1 in Raw 264.7 Cells Go to Link

Lee, Se-Min; Choi, Hye-Jin; Oh, Cheong-Hae; Oh, Jae-Won; Han, Joong-Soo

ArticleIssue Date2014CitationPLoS ONE, v.9, no.7, pp 1 - 9PublisherPublic Library of Science

SCOPUSESCI

Measurement of interfacial adhesion strength of Copper-Silicon based dielectric interfaces via laser spallation test Go to Link open access

Ju, Young-Min; Kim, Dukyong; Lee, Se-Min; Kim, Heuisu; Lee, Daewoong; Hwang, Yeon-Taek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2025CitationApplied Surface Science Advances, v.28, pp 1 - 12PublisherElsevier

SCOPUS

Measurement of the interfacial strength of thin metal film by laser spallation method for advanced wafer level package

Ju, Young-Min; Um, Hui-Jin; Lee, Se-Min; Kim, Dukyong; Yoo, Woong-Kyoo; Lee, Daewoong; Hwang, Yeontaek; Lee, Seung Hwan; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 1260 - 1264

SCIESCOPUS

Mixed mode fracture toughness of epoxy molding compound/ printed circuit board interface of semiconductor packages with respect to temperature and moisture Go to Link

Um, Hui-Jin; Lee, Se-Min; Lee, Dae-Woong; Ha, Sangyul; Kim, Hak-Sung

ArticleIssue Date2023CitationEngineering Fracture Mechanics, v.289, pp 1 - 14PublisherPergamon Press Ltd.

SCIESCOPUSKCI

Multi-scale (Macro-Meso-Micro) Progressive Failure Simulation of the Carbon Fiber Braided Structure Under Quasi-static Mechanical Loading Go to Link

Lee, Se-Min; Baek, Jeong-Hyeon; Yu, Myeong-Hyeon; Jeon, Seong-Wook; Choi, Woo-Seok; Heo, Sung-Pil; Yang, Moon-Ho; Park, Jun-Hong; Kim, Hak-Sung

ArticleIssue Date2025CitationInternational Journal of Precision Engineering and Manufacturing-Green Technology, v.12, no.5, pp 1501 - 1520Publisher한국정밀공학회

SCOPUS

STUDY ON THE EFFECT OF STRAIN RATE AND TEMPERATURE ON THE MECHANICAL BEHAVIOR OF POLYPROPYLENE AND THERMOPLASTIC OLEFIN

Lee, Se-Min; Kim, Gyu-Won; Han, In-Soo; Kim, Hak Sung

ArticleIssue Date2022CitationECCM 2022 - Proceedings of the 20th European Conference on Composite Materials: Composites Meet Sustainability, v.1, pp.479 - 485PublisherComposite Construction Laboratory (CCLab), Ecole Polytechnique Federale de Lausanne (EPFL)

ESCIKCI

Study on the Split Hopkinson Pressure Bar Apparatus for Measuring High-strain Rate Tensile Properties of Plastic Material Go to Link

Han, In-Soo; Lee, Se-Min; Kim, Kyu-Won; Kim, Hak-Sung

ArticleIssue Date2022CitationCOMPOSITES RESEARCH, v.35, no.3, pp 196 - 200PublisherKOREAN SOC COMPOSITE MATERIALS

SCISCIESCOPUSKCI

Virilizing Adrenocortical Oncocytoma in a Child: A Case Report Go to Link

Lim, Yeon-Jung; Lee, Se-Min; Shin, Jae-Hun; Koh, Hyun-Chul; Lee, Young-Ho

ArticleIssue Date2010CitationJournal of Korean Medical Science, v.25, no.7, pp 1077 - 1079Publisher대한의학회

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Browsing by Lee, Se-MinAuthor

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