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Chemical and Elecrtrical Charaterization of ALD Cobalt Nitride (CoN) as an Alternative Barrier for Advanced Cu InterconnectsGo to Link

Im, Yehbeen; Na, Youngseo; Lim, Hyun-jin; Kim, Donguk; Seo, Kangbaek; Lee, Seungchae; Choi, Chang hwan

ArticleIssue Date2025Citation2025 IEEE International Interconnect Technology Conference (IITC), pp 1 - 4PublisherInstitute of Electrical and Electronics Engineers Inc.
SCOPUS
Suppression of Size Effect in MoPd Thin Films for Nanoscale InterconnectsGo to Link

Lim, Hyun-jin; Lee, Seungchae; Na, Youngseo; Im, Yehbeen; Kim, Donguk; Seo, Kangbaek; Choi, Chang hwan

ArticleIssue Date2025Citation2025 IEEE International Interconnect Technology Conference (IITC), pp 1 - 3PublisherInstitute of Electrical and Electronics Engineers Inc.
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