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SCIESCOPUS
AlGaN/GaN Schottky HEMTs with UV/O3 Plasma-treated Gate InterfaceGo to Link

Kim, Kwangeun; Kim, Tong June; Zhang, Huilong; Liu, Dong; Jung, Yei Hwan; Gong, Jiarui; Ma, Zhenqiang

ArticleIssue Date2020CitationIEEE Electron Device Letters, v.41, no.10, pp 1488 - 1491PublisherInstitute of Electrical and Electronics Engineers
SCIESCOPUS
Design and Fabrication of Blue LED-Integrated Graphene Electrodes for Neural Stimulation and Signal RecordingGo to Link

Park, Jeongpil; Bong, Jihye; Jung, Yei Hwan; Kegel, Jack; Liu, Boyuan; Suminski, Aaron J.; Brodnick, Sarah K.; Jang, Hokyung; Yu, Zongfu; Williams, Justin C., et al.

ArticleIssue Date2021CitationACS APPLIED ELECTRONIC MATERIALS, v.3, no.10, pp.4308 - 4316PublisherAMER CHEMICAL SOC
SCIESCOPUS
Design and Fabrication of Stretchable Microwave Transmission Lines Based on a Quasi-Microstrip StructureGo to Link

Lee, Juhwan; Kim, Sun Hong; Zhang, Huilong; Min, Seunghwan; Choe, Geonoh; Ma, Zhenqiang; Jung, Yei Hwan

ArticleIssue Date2024CitationACS Applied Materials & Interfaces, v.16, no.4, pp 4896 - 4903PublisherAmerican Chemical Society
SCISCIESCOPUS
Flexible and Stretchable Microwave Microelectronic Devices and CircuitsGo to Link

Jung, Yei Hwan; Zhang, Huilong; Cho, Sang June; Ma, Zhenqiang

ArticleIssue Date2017CitationIEEE Transactions on Electron Devices, v.64, no.5, pp 1881 - 1893PublisherInstitute of Electrical and Electronics Engineers
SCIESCOPUS
Microwave Flexible Electronics Directly Transformed from Foundry-Produced, Multilayered Monolithic Integrated CircuitsGo to Linkopen access

Qin, Guoxuan; Jung, Yei Hwan; Zhang, Huilong; Jiang, Ningyue; Ma, Pingxi; Stetson, Scott; Racanelli, Marco; Ma, Zhenqiang

ArticleIssue Date2022CitationADVANCED ELECTRONIC MATERIALS, v.8, no.7, pp 1 - 8PublisherWILEY
SCISCIESCOPUS
Photolithography-based nanopatterning using re-entrant photoresist profileGo to Link

Kim, Tong June; Jung, Yei Hwan; Zhang, Huilong; Kim, Kwangeun; Lee, Juhwan; Ma, Zhenqiang

ArticleIssue Date2018CitationACS Applied Materials & Interfaces, v.10, no.9, pp 8117 - 8123PublisherAmerican Chemical Society
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