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SCOPUS
A New Fan-Out Package Structure Utilizing the Self-Alignment Effect of Molten Solder to Improve the Die Shift and Enhance the Thermal PropertiesGo to Link

Park, Hwan-Pil; Park, Jae-Yong; Seo, Gwancheol; Kim, Young-Ho

ArticleIssue Date2017CitationProceedings - Electronic Components and Technology Conference, pp 2212 - 2217
SCISCIESCOPUS
Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package ApplicationsGo to Link

Park, Hwan-Pil; Seo, Gwancheol; Kim, Sungchul; Kim, Young-Ho

ArticleIssue Date2018CitationJournal of Electronic Materials, v.47, no.1, pp 133 - 141PublisherInstitute of Electrical and Electronics Engineers
SCIESCOPUS
Joint properties and reliability of Cu/Sn-Ag pillar bumps via low-temperature thermo-compression bondingGo to Link

Park, Jae-Yong; Lee, Ja Yeon; Park, Hwan-Pil; Kim, Sung-Chul; Lee, Tae-Young; Yoo, Sehoon; Kim, Young-Ho

ArticleIssue Date2019CitationMICROELECTRONIC ENGINEERING, v.216, pp.1 - 7PublisherELSEVIER
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