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Effect of alkaline agent with organic additive in colloidal silica slurry on polishing rate selectivity of polysilicon-to-SiO2 in polysilicon CMP Go to Link

Hwang, Hee-Sub; Kang, Hyun-Goo; Park, Jin-Hyung; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun

ArticleIssue Date2008CitationECS Transactions, v.13, no.4, pp 67 - 73PublisherElectrochemical Society, Inc.

SCISCIESCOPUS

Effect of Nonionic Polymer as Corrosion Inhibitor in Alkaline Media for Polycrystalline Ge2Sb2Te5 Chemical Mechanical Planarization Go to Link

Cho, Jong-Young; Cui, Hao; Park, Jin-Hyung; Park, Hyung-Soon; Park, Jea-Gun

ArticleIssue Date2011CitationElectrochemical and Solid-State Letters, v.14, no.11, pp H450 - H452PublisherElectrochemical Society, Inc.

SCOPUS

Effect of organic amine in colloidal silica slurry on polishing-rate selectivity of copper to tantalum-nitride film in copper chemical mechanical planarization Go to Link

Park, Jin-Hyung; Cui, Hao; Hwang, Hee-Sub; Paik, Ungyu; Park, Hyung-Soon; Park, Jea-Gun

ArticleIssue Date2008CitationECS Transactions, v.13, no.4, pp 51 - 57PublisherElectrochemical Society, Inc.

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Browsing by Park, Hyung-SoonAuthor

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