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A New Ni-Zn under bump metallurgy for Pb-free solder bump flip chip application Go to Link

Cho, Hae-Young; Kim, Tae-Jin; Kim, Young Min; Kim, Sun-Chul; Park, Jin-Young; Kim, Young Ho

ArticleIssue Date2010CitationProceedings - Electronic Components and Technology Conference, pp 151 - 155

KCI

Calcific tendinitis of the shoulder in the Korean population: demographics and its relation with coexisting rotator cuff tear Go to Link open access

Yoo, Yon-Sik; Park, Jin-Young; Kim, Myung Sun; Cho, Nam-Su; Lee, Yong-Beom; Cho, Seung-Hyun; Park, Kyoung-Jin; Cho, Chul Hyun; Lee, Bong Gun; Shin, Dong Joo, et al.

ArticleIssue Date2021CitationClinics in Shoulder and Elbow, v.24, no.1, pp 21 - 26PublisherKorean Shoulder and Elbow Society

SCISCIESCOPUS

Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish Go to Link

Kim, Young Min; Park, Jin-Young; Kim, Young-Ho

ArticleIssue Date2012CitationJournal of Electronic Materials, v.41, no.4, pp 763 - 773PublisherInstitute of Electrical and Electronics Engineers

SCIESCOPUS

Identification and ultrastructural imaging of photodynamic therapy-induced microfilaments by atomic force microscopy Go to Link

Jung, Se-Hui; Park, Jin-Young; Yoo, Je-Ok; Shin, Incheol; Kim, Young-Myeong; Ha, Kwon-Soo

ArticleIssue Date2009CitationUltramicroscopy, v.109, no.12, pp 1428 - 1434PublisherElsevier BV

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Browsing by Park, Jin-YoungAuthor

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