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Advanced Bonding Process based on Intense Pulsed Light Irradiation for Solder Bump in Flip-Chip Package

Ryu, Seong-Ung; Park, Jong-Whi; Ju, Young-Min; Kim, Hak-Sung

ArticleIssue Date2024CitationProceedings - Electronic Components and Technology Conference, pp 2218 - 2222
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Ultra-Millisecond Flip-Chip Bonding Process via Intense Pulsed Light IrradiationGo to Link

Ju, Young-Min; Ryu, Seong-Ung; Park, Jong-Whi; Kim, Hak-Sung

ArticleIssue Date2025CitationACS Applied Materials & Interfaces, v.17, no.27, pp 39694 - 39707PublisherAmerican Chemical Society
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