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전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

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Effect of electroplating current density and post-annealing on the warpage and reliability of redistribution layer for advanced semiconductor packageGo to Linkopen access

Kim, Taek-Hyeon; Baek, Jeong-Hyeon; Kim, Sang-Il; Kim, Tae-Hoon; Shim, Ji-Hye; Kim, Hak-Sung

ArticleIssue Date2025CitationMaterials & Design, v.259, pp 1 - 11PublisherElsevier BV
SCIESCOPUS
Microstructured anisotropic PDMS sheet for damage-free electrical testing of semiconductor packagesGo to Link

Seol, Yulim; Jeong, Jaeheon; Shim, Ji-Hye; Kim, Hak-Sung; So, Hongyun

ArticleIssue Date2026CitationSensors and Actuators A: Physical, v.399, pp 1 - 11PublisherElsevier B.V.
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