ScholarWorks@Hanyang University

Browsing by Shin, ChanhoAuthor

All A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
전체 가 나 다 라 마 바 사 아 자 차 카 타 파 하

Showing results 1 to 2 of 2

SCISCIESCOPUS
Current-assisted direct Cu/Cu joiningGo to Link

Shin, Chanho; Ma, Sung Woo; Lee, Jeong Hwan; Kim, Ki Bum; Suh, Minsuk; Kim, Namseog; Kim, Young-Ho

ArticleIssue Date2015CitationScripta Materialia, v.104, pp 21 - 24PublisherPergamon Press Ltd.
SCIESCOPUS
Enhanced Bonding by Applied Current in Cu-to-Cu Joints Fabricated Using 20 mu m Cu MicrobumpsGo to Link

Ma, Sung Woo; Shin, Chanho; Kim, Young-Ho

ArticleIssue Date2017CitationJournal of Electronic Packaging, Transactions of the ASME, v.139, no.4PublisherASME
1
CONTACT US

RSS_1.0 RSS_2.0 ATOM_1.0

222, Wangsimni-ro, Seongdong-gu, Seoul, 04763, Korea+82-2-2220-1366

COPYRIGHT © 2024 HANYANG UNIVERSITY.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.
You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.

BROWSE

한국어