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Current-assisted direct Cu/Cu joining
- Authors
- Shin, Chanho; Ma, Sung Woo; Lee, Jeong Hwan; Kim, Ki Bum; Suh, Minsuk; Kim, Namseog; Kim, Young-Ho
- Issue Date
- Jul-2015
- Publisher
- Pergamon Press Ltd.
- Keywords
- Joining; Electromigration; Joule heating; Cu/Cu direct
- Citation
- Scripta Materialia, v.104, pp 21 - 24
- Pages
- 4
- Indexed
- SCI
SCIE
SCOPUS
- Journal Title
- Scripta Materialia
- Volume
- 104
- Start Page
- 21
- End Page
- 24
- ISSN
- 1359-6462
- Abstract
- Enhanced direct Cu/Cu joining by applying current was investigated. Joining was conducted at 240-300 degrees C for 10-50 min under 40 MPa. Current was applied to Cu wire during joining. Contact resistance of joints decreased and the fracture load of joints increased as the current increased. The joined region increased and the interface became less straight as the current increased. These results are ascribed to electromigration and joule heating effects. The enhanced diffusion contributed significantly to the joining of metals.
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Collections - 서울 공과대학 > 서울 신소재공학부 > 1. Journal Articles
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